Issued Patents 2017
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9818834 | Semiconductor device structure and method for forming the same | Hsiao-Ping Liu, Hung-Chang Hsu, Ming-Hsing Tsai, Rueijer Lin, Sheng-Hsuan Lin +2 more | 2017-11-14 |
| 9812397 | Method of forming hybrid diffusion barrier layer and semiconductor device thereof | Kai-Shiang Kuo, Ken-Yu Chang, Ya-Lien Lee | 2017-11-07 |
| 9805951 | Method of integration process for metal CMP | Chih-Chien Chi, Pei-Hsuan Lee | 2017-10-31 |
| 9786604 | Metal cap apparatus and method | Chen-Yuan Kao, Chih-Yi Chang, Liang-Yueh Ou Yang | 2017-10-10 |
| 9754882 | Interconnect structure having air gap and method of forming the same | Chih-Chien Chi | 2017-09-05 |
| 9632498 | Systems and methods of compensating for filling material losses in electroplating processes | Chih-Yi Chang, Liang-Yueh Ou Yang, Chen-Yuan Kao | 2017-04-25 |
| 9564398 | Chemical direct pattern plating interconnect metallization and metal structure produced by the same | Wen-Jiun Liu, Chen-Yuan Kao, Mingh-Hsing Tsai, Syun-Ming Jang | 2017-02-07 |