Issued Patents 2017
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9786604 | Metal cap apparatus and method | Hung-Wen Su, Chih-Yi Chang, Liang-Yueh Ou Yang | 2017-10-10 |
| 9754822 | Interconnect structure and method | Chia-Cheng Chou, Chih-Chien Chi, Chung-Chi Ko, Yao-Jen Chang, Kai-Shiang Kuo +3 more | 2017-09-05 |
| 9632498 | Systems and methods of compensating for filling material losses in electroplating processes | Chih-Yi Chang, Liang-Yueh Ou Yang, Hung-Wen Su | 2017-04-25 |
| 9601430 | Semiconductor device structure and method for forming the same | Rueijer Lin, Chun-Chieh Lin, Huang-Yi Huang | 2017-03-21 |
| 9564398 | Chemical direct pattern plating interconnect metallization and metal structure produced by the same | Wen-Jiun Liu, Hung-Wen Su, Mingh-Hsing Tsai, Syun-Ming Jang | 2017-02-07 |