Issued Patents 2017
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9768061 | Low-k dielectric interconnect systems | Po-Cheng Shih, Chung-Chi Ko | 2017-09-19 |
| 9754822 | Interconnect structure and method | Chih-Chien Chi, Chung-Chi Ko, Yao-Jen Chang, Chen-Yuan Kao, Kai-Shiang Kuo +3 more | 2017-09-05 |
| 9748134 | Method of making interconnect structure | Po-Cheng Shih, Yu-Yun Peng, Joung-Wei Liou | 2017-08-29 |
| 9679804 | Multi-patterning to form vias with straight profiles | Chun-Kai Chen, Jung-Hau Shiu, Chung-Chi Ko, Tze-Liang Lee, Chih-Hao Chen +1 more | 2017-06-13 |
| 9589856 | Automatically adjusting baking process for low-k dielectric material | Chung-Chi Ko, Keng-Chu Lin, Shwang-Ming Jeng | 2017-03-07 |