Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9754818 | Via patterning using multiple photo multiple etch | Chung-Chi Ko, Tze-Liang Lee, Wen-Kuo Hsieh, Yu-Yun Peng | 2017-09-05 |
| 9679804 | Multi-patterning to form vias with straight profiles | Chun-Kai Chen, Chia-Cheng Chou, Chung-Chi Ko, Tze-Liang Lee, Chih-Hao Chen +1 more | 2017-06-13 |