Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9754818 | Via patterning using multiple photo multiple etch | Jung-Hau Shiu, Chung-Chi Ko, Tze-Liang Lee, Yu-Yun Peng | 2017-09-05 |
| 9728445 | Method for forming conducting via and damascene structure | Ming-Chung Liang | 2017-08-08 |