Issued Patents 2017
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9812390 | Semiconductor devices including conductive features with capping layers and methods of forming the same | Hui-Chun Yang, Mei-Ling Chen, Keng-Chu Lin | 2017-11-07 |
| 9748134 | Method of making interconnect structure | Po-Cheng Shih, Yu-Yun Peng, Chia-Cheng Chou | 2017-08-29 |
| 9748175 | Conductive structure in semiconductor structure and method for forming the same | Yi-Jung Liu, Huan-Wei Wu, Chester Tang | 2017-08-29 |
| 9564383 | Low-K dielectric layer and porogen | Hui-Chun Yang, Yu-Yun Peng, Keng-Chu Lin | 2017-02-07 |