Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9691745 | Bonding structure for forming a package on package (PoP) structure and method for forming the same | Ming-Da Cheng, Chung-Shi Liu | 2017-06-27 |
JH
James Hu
Overall (2017): #388,309 of 506,227Top 80%
1
Patents 2017