GY

Gerald Yin

Applied Materials: 13 patents #5 of 912Top 1%
📍 Shanghai, CA: #2 of 87 inventorsTop 3%
Overall (2002): #893 of 266,432Top 1%
13
Patents 2002

Issued Patents 2002

Showing 1–13 of 13 patents

Patent #TitleCo-InventorsDate
6500357 System level in-situ integrated dielectric etch process particularly useful for copper dual damascene Lee Luo, Claes Bjorkman, Brian Sy-Yuan Shieh 2002-12-31
6488862 Etched patterned copper features free from etch process residue Yan Ye, Diana Xiaobing Ma 2002-12-03
6488807 Magnetic confinement in a plasma reactor having an RF bias electrode Kenneth S. Collins, Chan-Lon Yang, Jerry Wong, Jeffrey Marks, Peter Keswick +7 more 2002-12-03
6475335 RF plasma reactor with hybrid conductor and multi-radius dome ceiling Diana Xiabing Ma, Peter Loewenhardt, Philip M. Salzman, Allen Zhao, Hiroji Hanawa 2002-11-05
6471822 Magnetically enhanced inductively coupled plasma reactor with magnetically confined plasma Peter Loewenhardt, Arnold Kholodenko, Hong Chin Shan, Chii Guang Lee, Dan Katz 2002-10-29
6454898 Inductively coupled RF Plasma reactor having an overhead solenoidal antenna and modular confinement magnet liners Kenneth S. Collins, Michael R. Rice, Douglas A. Buchberger, Jr., Craig A. Roderick, Eric Askarinam +5 more 2002-09-24
6440866 Plasma reactor with heated source of a polymer-hardening precursor material Kenneth S. Collins, Michael R. Rice, David W. Groechel, Jon Mohn, Craig A. Roderick +5 more 2002-08-27
6402885 Magnetically enhanced inductively coupled plasma reactor with magnetically confined plasma Peter Loewenhardt, Philip M. Salzman 2002-06-11
6387287 Process for etching oxide using a hexafluorobutadiene and manifesting a wide process window Hoiman Hung, Joseph P. Caulfield, Hongqing Shan, Ruiping Wang 2002-05-14
6379575 Treatment of etching chambers using activated cleaning gas Xue-Yu Qian, Patrick Leahey, Jonathan D. Mohn, Waiching Chow, Arthur Y. Chen +2 more 2002-04-30
6361705 Plasma process for selectively etching oxide using fluoropropane or fluoropropylene Ruiping Wang, Hao Lu, Robert Wu, Jian Ding 2002-03-26
6352049 Plasma assisted processing chamber with separate control of species density Arnold Kolandenko, Hong Ching Shan, Peter Loewenhardt, Chii Guang Lee, Yan Ye +9 more 2002-03-05
6340435 Integrated low K dielectrics and etch stops Claes Bjorkman, Min Melissa Yu, Hongquing Shan, David Cheung, Wai-Fan Yau +7 more 2002-01-22