Issued Patents All Time
Showing 76–100 of 244 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10636661 | Apparatus and method for wafer bonding | Yeong-Jyh Lin, Chin-Wei Liang | 2020-04-28 |
| 10569520 | Wafer debonding system and method | Chang-Chen Tsao, Kuo-Liang Lu, Ru-Liang Lee, Sheng-Hsiang Chuang, Yu-Hung Cheng +1 more | 2020-02-25 |
| 10553474 | Method for forming a semiconductor-on-insulator (SOI) substrate | Cheng-Ta Wu, Chia-Shiung Tsai, Jiech-Fun Lu, Kuan-Liang Liu, Shih Pei Chou +1 more | 2020-02-04 |
| 10522487 | Semiconductor structure and manufacturing method thereof | Sheng-Chau Chen, Shih Pei Chou, Ming-Che Lee, Kuo-Ming Wu, Cheng-Hsien Chou +1 more | 2019-12-31 |
| 10516040 | Method of forming epitaxial silicon layer and semiconductor device thereof | Yu-Hung Cheng, Po-Jung Chiang, Yen-Hsiu Chen | 2019-12-24 |
| 10510723 | Buffer layer(s) on a stacked structure having a via | Chen-Fa Lu, Cheng-Yuan Tsai, Chia-Shiung Tsai | 2019-12-17 |
| 10504756 | Wafer processing method and apparatus | Chih-Hui Huang, Chun-Han Tsao, Sheng-Chau Chen, Chia-Shiung Tsai, Xiaomeng Chen | 2019-12-10 |
| 10468486 | SOI substrate, semiconductor device and method for manufacturing the same | Cheng-Ta Wu, Kuo-Hwa Tzeng, Chih-Hao Wang, Chung-Yi Yu | 2019-11-05 |
| 10453757 | Transistor channel | Yu-Hung Cheng, Ching-Wei Tsai, Tung-I Lin, Wei-Li Chen | 2019-10-22 |
| 10453889 | Dual facing BSI image sensors with wafer level stacking | Ping-Yin Liu, Chia-Shiung Tsai, Xiaomeng Chen, Pin-Nan Tseng | 2019-10-22 |
| 10410892 | Method of semiconductor wafer bonding and system thereof | Kuan-Liang Lu, Xin-Hua Huang | 2019-09-10 |
| 10361234 | 3DIC interconnect apparatus and method | Shih Pei Chou, Hung-Wen Hsu, Ching-Chung Su, Chun-Han Tsao, Chia-Chieh Lin +4 more | 2019-07-23 |
| 10351418 | Bond rings in semiconductor devices and methods of forming same | Chih-Ming Chen, Ping-Yin Liu, Chung-Yi Yu | 2019-07-16 |
| 10325956 | Deep trench isolation shrinkage method for enhanced device performance | Cheng-Hsien Chou, Shih Pei Chou, Chih-Yu Lai, Sheng-Chau Chen, Chih-Ta Chen +1 more | 2019-06-18 |
| 10319768 | Image sensor scheme for optical and electrical improvement | Sheng-Chan Li, Cheng-Hsien Chou, Cheng-Yuan Tsai, Keng-Yu Chou | 2019-06-11 |
| 10304723 | Process to form SOI substrate | Yu-Hung Cheng, Cheng-Ta Wu, Ming-Che Yang, Wei-Kung Tsai, Yong-En Syu +1 more | 2019-05-28 |
| 10290502 | Apparatus for reducing stripe patterns | Chung Chien Wang, Cheng-Ta Wu, Chia-Shiung Tsai | 2019-05-14 |
| 10269864 | Pixel isolation device and fabrication method | Yu-Hung Cheng, Tung-I Lin, Wei-Li Chen | 2019-04-23 |
| 10269843 | BSI image sensor and method of forming same | Hung-Wen Hsu, Jiech-Fun Lu, U-Ting Chen, Shu-Ting Tsai, Hsiu-Yu Cheng | 2019-04-23 |
| 10204822 | Method for forming trench liner passivation | Cheng-Hsien Chou, Hung-Ling Shih, Tsun-Kai Tsao, Ming-Huei Shen, Kuo-Hwa Tzeng | 2019-02-12 |
| 10177106 | Conductive pad structure for hybrid bonding and methods of forming same | Sheng-Chau Chen, Shih Pei Chou, Yen-Chang Chu, Cheng-Hsien Chou, Chih-Hui Huang | 2019-01-08 |
| 10170539 | Stacked capacitor with enhanced capacitance | Szu-Yu Wang, Chih-Yu Lai | 2019-01-01 |
| 10163647 | Method for forming deep trench structure | Min-Ying Tsai, Cheng-Ta Wu | 2018-12-25 |
| 10163947 | Photodiode gate dielectric protection layer | Cheng-Hsien Chou, Wen-I Hsu, Tsun-Kai Tsao, Chih-Yu Lai, Jiech-Fun Lu | 2018-12-25 |
| 10163949 | Image device having multi-layered refractive layer on back surface | Chih-Yu Lai, Min-Ying Tsai, Hai-Dang Trinh, Cheng-Yuan Tsai | 2018-12-25 |