Issued Patents All Time
Showing 26–50 of 244 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11594597 | Selective polysilicon growth for deep trench polysilicon isolation structure | Yu-Hung Cheng, Cheng-Ta Wu, Po-Wei Liu, Yu-Chun Chang | 2023-02-28 |
| 11545513 | Image sensor having improved full well capacity and related method of formation | Yu-Hung Cheng, Shyh-Fann Ting, Yen-Ting Chiang, Min-Ying Tsai | 2023-01-03 |
| 11495489 | Method for forming a semiconductor-on-insulator (SOI) substrate | Cheng-Ta Wu, Chia-Shiung Tsai, Jiech-Fun Lu, Kuan-Liang Liu, Shih Pei Chou +1 more | 2022-11-08 |
| 11430729 | MIM capacitor with a symmetrical capacitor insulator structure | Hsing-Lien Lin, Cheng-Te Lee, Rei-Lin Chu, Chii-Ming Wu, Chung-Yi Yu | 2022-08-30 |
| 11404465 | Epitaxial semiconductor liner for enhancing uniformity of a charged layer in a deep trench and methods of forming the same | Ru-Liang Lee, Yu-Hung Cheng | 2022-08-02 |
| 11398516 | Conductive contact for ion through-substrate via | Min-Ying Tsai, Cheng-Ta Wu | 2022-07-26 |
| 11348790 | Apparatus and method for wafer bonding | Yeong-Jyh Lin, Chin-Wei Liang | 2022-05-31 |
| 11315972 | BSI image sensor and method of forming same | Hung-Wen Hsu, Jiech-Fun Lu, U-Ting Chen, Shu-Ting Tsai, Hsiu-Yu Cheng | 2022-04-26 |
| 11276587 | Wafer bonding method and apparatus with curved surfaces | Chih-Hui Huang, Chun-Han Tsao, Sheng-Chau Chen, Chia-Shiung Tsai, Xiaomeng Chen | 2022-03-15 |
| 11270978 | Buffer layer(s) on a stacked structure having a via | Chen-Fa Lu, Cheng-Yuan Tsai, Chia-Shiung Tsai | 2022-03-08 |
| 11264469 | Method for forming thin semiconductor-on-insulator (SOI) substrates | Cheng-Ta Wu, Chia-Shiung Tsai, Jiech-Fun Lu, Kuo-Hwa Tzeng, Shih Pei Chou +1 more | 2022-03-01 |
| 11232974 | Fabrication method of metal-free SOI wafer | Yu-Hung Cheng, Pu Chen, Cheng-Ta Wu, Po-Jung Chiang, Ru-Liang Lee +4 more | 2022-01-25 |
| 11232975 | Semiconductor-on-insulator (SOI) substrate having dielectric structures that increase interface bonding strength | Min-Ying Tsai | 2022-01-25 |
| 11232946 | Method of optimizing film deposition process in semiconductor fabrication by using gas sensor | Rei-Lin Chu, Chih-Ming Chen, Chung-Yi Yu | 2022-01-25 |
| 11211259 | Structure and method for embedded gettering in a silicon on insulator wafer | Pu Chen, Shi-Chieh Lin, Victor Lu | 2021-12-28 |
| 11201183 | Image sensor device and method | Yen-Chang Chu, Cheng-Yuan Tsai | 2021-12-14 |
| 11189515 | Method for alignment, process tool and method for wafer-level alignment | Ching-Hung Wang, Ping-Yin Liu, Yeong-Jyh Lin | 2021-11-30 |
| 11189583 | Semiconductor structure and manufacturing method thereof | Sheng-Chau Chen, Shih Pei Chou, Ming-Che Lee, Kuo-Ming Wu, Cheng-Hsien Chou +1 more | 2021-11-30 |
| 11171015 | Multi-layered polysilicon and oxygen-doped polysilicon design for RF SOI trap-rich poly layer | Yu-Hung Cheng, Cheng-Ta Wu, Chen-Hao Chiang, Alexander Kalnitsky, Eugene Chen | 2021-11-09 |
| 11171039 | Composite semiconductor substrate, semiconductor device and method for manufacturing the same | Min-Ying Tsai, Cheng-Ta Wu, Yu-Hung Cheng | 2021-11-09 |
| 11164945 | SOI substrate, semiconductor device and method for manufacturing the same | Cheng-Ta Wu, Kuo-Hwa Tzeng, Chih-Hao Wang, Chung-Yi Yu | 2021-11-02 |
| 11158534 | SOI substrate | Yu-Hung Cheng, Cheng-Ta Wu, Ming-Che Yang, Wei-Kung Tsai, Yong-En Syu +1 more | 2021-10-26 |
| 11101307 | Image sensor having stacked conformal films | Chih-Yu Lai, Min-Ying Tsai, Hai-Dang Trinh, Cheng-Yuan Tsai | 2021-08-24 |
| 11069733 | Image sensor having improved full well capacity and related method of formation | Yu-Hung Cheng, Shyh-Fann Ting, Yen-Ting Chiang, Min-Ying Tsai | 2021-07-20 |
| 11063117 | Semiconductor device structure having carrier-trapping layers with different grain sizes | Yu-Hung Cheng, Yong-En Syu, Kuo-Hwa Tzeng, Ke-Dian Wu, Cheng-Ta Wu +2 more | 2021-07-13 |