Issued Patents All Time
Showing 351–375 of 399 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9123763 | Package-on-package (PoP) structure having at least one package comprising one die being disposed in a core material between first and second surfaces of the core material | Chen-Hua Yu, Chung-Shi Liu, Mirng-Ji Lii, Chih-Wei Lin | 2015-09-01 |
| 9117816 | Process for forming package-on-package structures | Chih-Wei Lin, Meng-Tse Chen, Wen-Hsiung Lu, Kuei-Wei Huang, Chung-Shi Liu | 2015-08-25 |
| 9082636 | Packaging methods and structures for semiconductor devices | Chih-Wei Lin, Kuei-Wei Huang, Yu-Peng Tsai, Chun-Cheng Lin, Meng-Tse Chen +7 more | 2015-07-14 |
| 9082776 | Semiconductor package having protective layer with curved surface and method of manufacturing same | Wen-Hsiung Lu, Yi-Wen Wu, Yu-Peng Tsai, Chia-Wei Tu, Chung-Shi Liu | 2015-07-14 |
| 9073158 | Methods for forming 3DIC package | Meng-Tse Chen, Chun-Cheng Lin, Kuei-Wei Huang, Yu-Peng Tsai, Wei-Hung Lin +1 more | 2015-07-07 |
| 9059109 | Package assembly and method of forming the same | Hung-Jen Lin, Tsung-Ding Wang, Chien-Hsiun Lee, Wen-Hsiung Lu, Chung-Shi Liu | 2015-06-16 |
| 9059148 | Contact structure | Meng-Tse Chen, Wei-Hung Lin, Kuei-Wei Huang, Chih-Wei Lin, Chih-Chun Chiu +1 more | 2015-06-16 |
| 9054047 | Exposing connectors in packages through selective treatment | Chen-Hua Yu, Chung-Shi Liu, Chun-Cheng Lin, Meng-Tse Chen | 2015-06-09 |
| 9030022 | Packages and methods for forming the same | Meng-Tse Chen, Chun-Cheng Lin, Yu-Peng Tsai, Hsiu-Jen Lin, Chung-Shi Liu | 2015-05-12 |
| 9021682 | Apparatus for stud bump formation | Chien Ling Hwang, Yeong-Jyh Lin, Yi-Li Hsiao, Tsai-Tsung Tsai, Chung-Shi Liu +2 more | 2015-05-05 |
| 9006097 | Cu pillar bump with electrolytic metal sidewall protection | Wen-Hsiung Lu, Chih-Wei Lin, Jacky Chang, Chung-Shi Liu, Chen-Hua Yu | 2015-04-14 |
| 8993431 | Method of fabricating bump structure | Chun-Lei Hsu, Ming-Che Ho, Chung-Shi Liu | 2015-03-31 |
| 8987058 | Method for wafer separation | Yu-Peng Tsai, Wen-Hsiung Lu, Cheng-Ting Chen, Hsien-Wei Chen, Chung-Shi Liu | 2015-03-24 |
| 8987915 | Semiconductor structure and manufacturing method thereof | Chen-Hua Yu, Mirng-Ji Lii, Chung-Shi Liu, Chang-Chia Huang, Chih-Wei Lin | 2015-03-24 |
| 8975741 | Process for forming package-on-package structures | Chih-Wei Lin, Meng-Tse Chen, Wen-Hsiung Lu, Kuei-Wei Huang, Chung-Shi Liu | 2015-03-10 |
| 8928134 | Package on package bonding structure and method for forming the same | Kuei-Wei Huang, Wei-Yu Chen, Meng-Tse Chen, Wei-Hung Lin, Chung-Shi Liu | 2015-01-06 |
| 8927391 | Package-on-package process for applying molding compound | Meng-Tse Chen, Wei-Hung Lin, Sheng-Yu Wu, Chun-Cheng Lin, Kuei-Wei Huang +6 more | 2015-01-06 |
| 8912651 | Package-on-package (PoP) structure including stud bulbs and method | Chen-Hua Yu, Mirng-Ji Lii, Chung-Shi Liu | 2014-12-16 |
| 8901726 | Package on package structure and method of manufacturing the same | Chun-Cheng Lin, Hsiu-Jen Lin, Cheng-Ting Chen, Wei-Yu Chen, Chung-Shi Liu | 2014-12-02 |
| 8900922 | Fine-pitch package-on-package structures and methods for forming the same | Cheng-Chung Lin, Kuei-Wei Huang, Ai-Tee Ang, Tsai-Tsung Tsai, Chung-Shi Liu | 2014-12-02 |
| 8889486 | Methods and apparatus for package on package structures | Meng-Tse Chen, Yi-Da Tsai, Xi Chen, Tao-Hua Lee, Wei-Yu Chen +1 more | 2014-11-18 |
| 8884431 | Packaging methods and structures for semiconductor devices | Chih-Wei Lin, Wen-Hsiung Lu, Hsiu-Jen Lin, Bor-Ping Jang, Chung-Shi Liu +7 more | 2014-11-11 |
| 8853002 | Methods for metal bump die assembly | Hsiu-Jen Lin, Ai-Tee Ang, Yu-Jen Tseng, Yu-Peng Tsai, Chung-Shi Liu | 2014-10-07 |
| 8846448 | Warpage control in a package-on-package structure | Meng-Tse Chen, Wei-Hung Lin, Kuei-Wei Huang, Tsai-Tsung Tsai, Ai-Tee Ang +1 more | 2014-09-30 |
| 8828861 | Method for fabricating conductive lines of a semiconductor device | Tuung Luoh, Chin-Ta Su, Tahone Yang, Kuang-Chao Chen | 2014-09-09 |