Issued Patents All Time
Showing 376–399 of 399 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8809117 | Packaging process tools and packaging methods for semiconductor devices | Wen-Hsiung Lu, Wei-Hung Lin, Kuei-Wei Huang, Chih-Wei Lin, Chun-Cheng Lin +1 more | 2014-08-19 |
| 8735273 | Forming wafer-level chip scale package structures with reduced number of seed layers | Wen-Hsiung Lu, Chih-Wei Lin, Yi-Wen Wu, Hsiu-Jen Lin, Chung-Shi Liu +2 more | 2014-05-27 |
| 8703546 | Activation treatments in plating processes | Chih-Wei Lin, Ming-Che Ho, Chung-Shi Liu | 2014-04-22 |
| 8674496 | System and method for fine pitch PoP structure | Cheng-Chung Lin, Hsiu-Jen Lin, Cheng-Ting Chen, Chun-Cheng Lin, Chung-Shi Liu | 2014-03-18 |
| 8664040 | Exposing connectors in packages through selective treatment | Chen-Hua Yu, Chung-Shi Liu, Chun-Cheng Lin, Meng-Tse Chen | 2014-03-04 |
| 8659155 | Mechanisms for forming copper pillar bumps | Wen-Hsiung Lu, Chih-Wei Lin, Ching-Wen Chen, Yi-Wen Wu, Chia-Tung Chang +2 more | 2014-02-25 |
| 8653592 | Isolation structure, non-volatile memory having the same, and method of fabricating the same | Chin-Tsan Yeh, Tuung Luoh, Chin-Ta Su, Ta-Hung Yang, Kuang-Chao Chen | 2014-02-18 |
| 8642445 | Method and apparatus for reducing package warpage | Meng-Tse Chen, Hui-Min Huang, Chun-Cheng Lin, Chih-Chun Chiu, Chung-Shi Liu | 2014-02-04 |
| 8623756 | Reflow system and method for conductive connections | Chita Chuang, Sheng-Yu Wu, Tin-Hao Kuo, Pei-Chun Tsai, Chen-Shien Chen | 2014-01-07 |
| 8616433 | Forming low stress joints using thermal compress bonding | Kuei-Wei Huang, Wei-Hung Lin, Lin-Wei Wang, Bor-Ping Jang, Chung-Shi Liu | 2013-12-31 |
| 8609462 | Methods for forming 3DIC package | Meng-Tse Chen, Chun-Cheng Lin, Kuei-Wei Huang, Yu-Peng Tsai, Wei-Hung Lin +1 more | 2013-12-17 |
| 8603860 | Process for forming packages | Meng-Tse Chen, Kuei-Wei Huang, Wei-Hung Lin, Wen-Hsiung Lu, Chung-Shi Liu | 2013-12-10 |
| 8598691 | Semiconductor devices and methods of manufacturing and packaging thereof | Sheng-Yu Wu, Tin-Hao Kuo, Chen-Shien Chen | 2013-12-03 |
| 8586408 | Contact and method of formation | Meng-Tse Chen, Wei-Hung Lin, Kuei-Wei Huang, Chih-Wei Lin, Chih-Chun Chiu +1 more | 2013-11-19 |
| 8581401 | Mechanisms for forming copper pillar bumps using patterned anodes | Wen-Hsiung Lu, Chih-Wei Lin, Chung-Shi Liu | 2013-11-12 |
| 8546254 | Mechanisms for forming copper pillar bumps using patterned anodes | Wen-Hsiung Lu, Chih-Wei Lin, Chung-Shi Liu | 2013-10-01 |
| 8501615 | Metal bump formation | Chih-Wei Lin, Hsiu-Jen Lin, Tzong-Hann Yang, Wen-Hsiung Lu, Zheng-Yi Lim +2 more | 2013-08-06 |
| 8492891 | Cu pillar bump with electrolytic metal sidewall protection | Wen-Hsiung Lu, Chih-Wei Lin, Jacky Chang, Chung-Shi Liu, Chen-Hua Yu | 2013-07-23 |
| 8440503 | Methods for performing reflow in bonding processes | Hsiu-Jen Lin, Chih-Wei Lin, Cheng-Ting Chen, Chung-Shi Liu | 2013-05-14 |
| 8405199 | Conductive pillar for semiconductor substrate and method of manufacture | Wen-Hsiung Lu, Chih-Wei Lin, Ming-Che Ho, Chung-Shi Liu | 2013-03-26 |
| 8360303 | Forming low stress joints using thermal compress bonding | Kuei-Wei Huang, Wei-Hung Lin, Lin-Wei Wang, Bor-Ping Jang, Chung-Shi Liu | 2013-01-29 |
| 8242011 | Method of forming metal pillar | Zheng-Yi Lim, Yi-Wen Wu, Wen-Hsiung Lu, Chih-Wei Lin, Tzong-Huann Yang +2 more | 2012-08-14 |
| 8227334 | Doping minor elements into metal bumps | Ming-Che Ho, Chung-Shi Liu, Chien Ling Hwang, Cheng-Chung Lin, Hui-Jung Tsai +1 more | 2012-07-24 |
| 8067292 | Isolation structure, non-volatile memory having the same, and method of fabricating the same | Chin-Tsan Yeh, Tuung Luoh, Chin-Ta Su, Ta-Hung Yang, Kuang-Chao Chen | 2011-11-29 |