Issued Patents All Time
Showing 326–350 of 399 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9349663 | Package-on-package structure having polymer-based material for warpage control | Meng-Tse Chen, Yu-Chih Liu, Hui-Min Huang, Wei-Hung Lin, Jing Ruei Lu +1 more | 2016-05-24 |
| 9343386 | Alignment in the packaging of integrated circuits | Kuei-Wei Huang, Chih-Wei Lin, Wei-Hung Lin, Chung-Shi Liu | 2016-05-17 |
| 9331038 | Semiconductor interconnect structure | Meng-Tse Chen, Hsiu-Jen Lin, Chih-Wei Lin, Chih-Hang Tung, Chung-Shi Liu | 2016-05-03 |
| 9324587 | Method for manufacturing semiconductor structure | Chen-Hua Yu, Chih-Fan Huang, Chun-Hung Lin, Chung-Shi Liu, Mirng-Ji Lii | 2016-04-26 |
| 9318386 | Wafer alignment methods in die sawing process | Yu-Hsiang Hu, Chung-Shi Liu | 2016-04-19 |
| 9312214 | Semiconductor packages having polymer-containing substrates and methods of forming same | Meng-Tse Chen, Chih-Wei Lin, Chun-Cheng Lin, Wen-Hsiung Lu, Chung-Shi Liu | 2016-04-12 |
| 9312243 | Semiconductor packages | Meng-Tse Chen, Yi-Da Tsai, Xi Chen, Tao-Hua Lee, Wei-Yu Chen +1 more | 2016-04-12 |
| 9299688 | Packaged semiconductor devices and methods of packaging semiconductor devices | Chen-Hua Yu, Chung-Shi Liu, Chih-Fan Huang, Hui-Min Huang, Wei-Hung Lin | 2016-03-29 |
| 9287143 | Apparatus for package reinforcement using molding underfill | Hsien-Wei Chen, Tsung-Yuan Yu, Wen-Hsiung Lu, Hao-Yi Tsai, Mirng-Ji Lii +1 more | 2016-03-15 |
| 9287203 | Package-on-package structure and method of forming same | Chih-Wei Lin, Wen-Hsiung Lu, Hsuan-Ting Kuo, Wei-Yu Chen, Chung-Shi Liu | 2016-03-15 |
| 9281288 | System and method for fine pitch PoP structure | Cheng-Chung Lin, Hsiu-Jen Lin, Cheng-Ting Chen, Chun-Cheng Lin, Chung-Shi Liu | 2016-03-08 |
| 9269687 | Packaging methods and packaged semiconductor devices | Meng-Tse Chen, Wei-Hung Lin, Yu-Peng Tsai, Chun-Cheng Lin, Chih-Wei Lin +1 more | 2016-02-23 |
| 9269658 | Ball amount process in the manufacturing of integrated circuit | Hsien-Wei Chen, Tsung-Yuan Yu, Wen-Hsiung Lu | 2016-02-23 |
| 9263839 | System and method for an improved fine pitch joint | Cheng-Ting Chen, Wen-Hsiung Lu, Chung-Shi Liu, Mirng-Ji Lii | 2016-02-16 |
| 9263412 | Packaging methods and packaged semiconductor devices | Wei-Hung Lin, Chung-Shi Liu, Wei-Yu Chen, Hsiu-Jen Lin, Kuei-Wei Huang | 2016-02-16 |
| 9257401 | Method of fabricating bump structure and bump structure | Chun-Lei Hsu, Ming-Che Ho, Chung-Shi Liu | 2016-02-09 |
| 9257333 | Interconnect structures and methods of forming same | Wen-Hsiung Lu, Hsuan-Ting Kuo, Tsung-Yuan Yu, Hsien-Wei Chen, Chung-Shi Liu | 2016-02-09 |
| 9257321 | Singulation apparatus and method | Chun-Cheng Lin, Yu-Peng Tsai, Meng-Tse Chen, Chung-Shi Liu | 2016-02-09 |
| 9252135 | Packaged semiconductor devices and methods of packaging semiconductor devices | Chen-Hua Yu, Chung-Shi Liu, Chih-Fan Huang, Chih-Wei Lin, Wei-Hung Lin | 2016-02-02 |
| 9230935 | Package on package structure and method of manufacturing the same | Chun-Cheng Lin, Hsiu-Jen Lin, Cheng-Ting Chen, Wei-Yu Chen, Chung-Shi Liu | 2016-01-05 |
| 9218999 | Packaging process tools and packaging methods for semiconductor devices | Wen-Hsiung Lu, Wei-Hung Lin, Kuei-Wei Huang, Chih-Wei Lin, Chun-Cheng Lin +1 more | 2015-12-22 |
| 9219030 | Package on package structures and methods for forming the same | Chen-Hua Yu, Mirng-Ji Lii, Chung-Shi Liu, Meng-Tse Chen, Wei-Hung Lin | 2015-12-22 |
| 9209149 | Bump-on-trace structures with high assembly yield | Chih-Fan Huang, Yi-Teh Chou, Tin-Hao Kuo, Chung-Shi Liu, Chen-Shien Chen | 2015-12-08 |
| 9196559 | Directly sawing wafers covered with liquid molding compound | Yu-Peng Tsai, Wen-Hsiung Lu, Chia-Wei Tu, Chung-Shi Liu | 2015-11-24 |
| 9171790 | Package on package devices and methods of packaging semiconductor dies | Chen-Hua Yu, Yung Ching Chen, Chien-Hsun Lee, Jiun Yi Wu, Mirng-Ji Lii | 2015-10-27 |