| 8324605 |
Dielectric mesh isolated phase change structure for phase change memory |
Hsiang-Lan Lung, Chieh-Fang Chen, Yen-Hao Shih, Ming-Hsiu Lee, Matthew J. Breitwisch +3 more |
2012-12-04 |
| 7951708 |
Copper interconnect structure with amorphous tantalum iridium diffusion barrier |
Patrick W. DeHaven, Daniel C. Edelstein, Takeshi Nogami, Stephen M. Rossnagel, Chih-Chao Yang |
2011-05-31 |
| 7820559 |
Structure to improve adhesion between top CVD low-K dielectric and dielectric capping layer |
Lawrence A. Clevenger, Stefanie Chiras, Timothy J. Dalton, James J. Demarest, Darren N. Dunn +7 more |
2010-10-26 |
| 7402532 |
Structure to improve adhesion between top CVD low-k dielectric and dielectric capping layer |
Lawrence A. Clevenger, Stefanie Chiras, Timothy J. Dalton, James J. Demarest, Derren N. Dunn +7 more |
2008-07-22 |
| 7102232 |
Structure to improve adhesion between top CVD low-k dielectric and dielectric capping layer |
Lawrence A. Clevenger, Stefanie Chiras, Timothy J. Dalton, James J. Demarest, Derren N. Dunn +7 more |
2006-09-05 |
| 6960514 |
Pitcher-shaped active area for field effect transistor and method of forming same |
Jochen Beintner, Rama Divakaruni, Johnathan E. Faltermeier, Oleg Gluschenkov, Carol J. Heenan +5 more |
2005-11-01 |
| 6746933 |
Pitcher-shaped active area for field effect transistor and method of forming same |
Jochen Beintner, Rama Divakaruni, Johnathan E. Faltermeier, Oleg Gluschenkov, Carol J. Heenan +5 more |
2004-06-08 |
| 6740568 |
Method to enhance epitaxial regrowth in amorphous silicon contacts |
Yun-Yu Wang, Johnathan E. Faltermeier, Colleen Snavely, Michael Maldei, Michael Iwatake +4 more |
2004-05-25 |
| 6707086 |
Method for forming crystalline silicon nitride |
Rajarao Jammy, Philip Edward Batson, Hua Shen, Yun-Yu Wang |
2004-03-16 |
| 6410399 |
Process to lower strap, wordline and bitline contact resistance in trench-based DRAMS by silicidization |
Herbert L. Ho, Subramanian S. Iyer, Babar A. Khan, Paul C. Parries |
2002-06-25 |
| 6333531 |
Dopant control of semiconductor devices |
Yun-Yu Wang, Johnathan E. Faltermeier, Jeffery L. Hurd, Rajarao Jammy, Radhika Srinivasan +2 more |
2001-12-25 |
| 6046487 |
Shallow trench isolation with oxide-nitride/oxynitride liner |
John Benedict, David M. Dobuzinsky, Erwin Hammerl, Herbert L. Ho, James F. Moseman +3 more |
2000-04-04 |
| 5763315 |
Shallow trench isolation with oxide-nitride/oxynitride liner |
John Benedict, David M. Dobuzinsky, Erwin Hammerl, Herbert L. Ho, James F. Moseman +3 more |
1998-06-09 |
| 5167913 |
Method of forming an adherent layer of metallurgy on a ceramic substrate |
John Acocella, Raj N. Master, Chandrasekhar Narayan, Sarah H. Knickerbocker, Paul H. Palmateer +2 more |
1992-12-01 |
| 5130067 |
Method and means for co-sintering ceramic/metal MLC substrates |
Arlyne M. Flanagan, Joseph M. Harvilchuck, Lester W. Herron, John U. Knickerbocker, Robert W. Nufer +3 more |
1992-07-14 |
| 4764341 |
Bonding of pure metal films to ceramics |
Raj N. Master, Paul H. Palmateer, Srinivasa S. N. Reddy |
1988-08-16 |
| 4755631 |
Apparatus for providing an electrical connection to a metallic pad situated on a brittle dielectric substrate |
Robert W. Churchwell, James N. Humenik |
1988-07-05 |
| 4672739 |
Method for use in brazing an interconnect pin to a metallization pattern situated on a brittle dielectric substrate |
Robert W. Churchwell, James N. Humenik |
1987-06-16 |
