Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 4755631 | Apparatus for providing an electrical connection to a metallic pad situated on a brittle dielectric substrate | Philip L. Flaitz, James N. Humenik | 1988-07-05 |
| 4672739 | Method for use in brazing an interconnect pin to a metallization pattern situated on a brittle dielectric substrate | Philip L. Flaitz, James N. Humenik | 1987-06-16 |