Issued Patents All Time
Showing 51–75 of 98 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7569125 | Shields usable with an inductively coupled plasma reactor | Tza-Jing Gung, Xianmin Tang, Peijun Ding, Marc Schweitzer, Keith A. Miller +1 more | 2009-08-04 |
| 7550090 | Oxygen plasma clean to remove carbon species deposited on a glass dome surface | Quancheng (Tommy) Gu, Cheng-Hsiung Tsai, Xiaoxi Guo, Larry Frazier | 2009-06-23 |
| 7504006 | Self-ionized and capacitively-coupled plasma for sputtering and resputtering | Praburam Gopalraja, Jianming Fu, Xianmin Tang, Umesh M. Kelkar | 2009-03-17 |
| 7335282 | Sputtering using an unbalanced magnetron | Jianming Fu, Praburam Gopalraja, Fusen Chen | 2008-02-26 |
| 7253109 | Method of depositing a tantalum nitride/tantalum diffusion barrier layer system | Peijun Ding, Zheng Xu, Hong Mei Zhang, Xianmin Tang, Praburam Gopalraja +7 more | 2007-08-07 |
| 7163607 | Process kit for improved power coupling through a workpiece in a semiconductor wafer processing system | Bradley O. Stimson, Mitsuhiro Kaburaki, Eric Delaurentis, Praburam Gopalraja, Patricia Rodriguez +1 more | 2007-01-16 |
| 7097744 | Method and apparatus for controlling darkspace gap in a chamber | Alan Liu, Marc Schweitzer, James Van Gogh, Michael Rosenstein, Jennifer Watia +3 more | 2006-08-29 |
| 7048837 | End point detection for sputtering and resputtering | Sasson Somekh, Marc Schweitzer, Zheng Xu, Roderick C. Mosely, Barry Chin +1 more | 2006-05-23 |
| 7041201 | Sidewall magnet improving uniformity of inductively coupled plasma and shields used therewith | Tza-Jing Gung, Xianmin Tang, Peijun Ding, Marc Schweitzer, Keith A. Miller +1 more | 2006-05-09 |
| 6911124 | Method of depositing a TaN seed layer | Xianmin Tang, Praburam Gopalraja, Suraj Rengarajan, Jianming Fu, Peijun Ding | 2005-06-28 |
| 6887786 | Method and apparatus for forming a barrier layer on a substrate | Hong Mei Zhang, Xianmin Tang, Praburam Gopalraja, Jick Yu | 2005-05-03 |
| 6783639 | Coils for generating a plasma and for sputtering | Jaim Nulman, Sergio Edelstein, Mani Subramani, Zheng Xu, Howard Grunes +2 more | 2004-08-31 |
| 6723214 | Apparatus for improved power coupling through a workpiece in a semiconductor wafer processing system | Bradley O. Stimson, Mitsuhiro Kaburaki, Eric Delaurentis, Praburam Gopalraja, Patricia Rodriguez +1 more | 2004-04-20 |
| 6679981 | Inductive plasma loop enhancing magnetron sputtering | Shaoher X. Pan, Hiroji Hanawa, Fusen Chen | 2004-01-20 |
| 6673724 | Pulsed-mode RF bias for side-wall coverage improvement | Praburam Gopalraja, Bradley O. Stimson, Liubo Hong | 2004-01-06 |
| 6660134 | Feedthrough overlap coil | Praburam Gopalraja, Zheng Xu, Michael Rosenstein | 2003-12-09 |
| 6620296 | Target sidewall design to reduce particle generation during magnetron sputtering | James Gogh, Jim Thompson, Marc Schweitzer, Yoichiro Tanaka, Alan Liu +2 more | 2003-09-16 |
| 6579426 | Use of variable impedance to control coil sputter distribution | James Van Gogh | 2003-06-17 |
| 6565717 | Apparatus for sputtering ionized material in a medium to high density plasma | David M. Leet | 2003-05-20 |
| 6500762 | Method of depositing a copper seed layer which promotes improved feature surface coverage | Imran Hashim, Hong Mei Zhang | 2002-12-31 |
| 6461483 | Method and apparatus for performing high pressure physical vapor deposition | Praburam Gopalraja, Bradley O. Stimson, Wei Wang | 2002-10-08 |
| 6409890 | Method and apparatus for forming a uniform layer on a workpiece during sputtering | Howard Grunes, Zheng Xu, Praburam Gopalraja, Ralf Hofmann, Anantha K. Subramani | 2002-06-25 |
| 6391776 | Method of depositing a copper seed layer which promotes improved feature surface coverage | Imran Hashim, Hong Mei Zhang | 2002-05-21 |
| 6368469 | Coils for generating a plasma and for sputtering | Jaim Nulman, Sergio Edelstein, Mani Subramani, Zheng Xu, Howard Grunes +2 more | 2002-04-09 |
| 6344419 | Pulsed-mode RF bias for sidewall coverage improvement | Praburam Gopalraja, Bradley O. Stimson, Liubo Hong | 2002-02-05 |