Issued Patents All Time
Showing 76–100 of 116 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7754997 | Apparatus and method to confine plasma and reduce flow resistance in a plasma | Kallol Bera, Yan Ye, James D. Carducci, Steven C. Shannon, Douglas A. Buchberger, Jr. | 2010-07-13 |
| 7695983 | Independent control of ion density, ion energy distribution and ion dissociation in a plasma reactor | — | 2010-04-13 |
| 7674353 | Apparatus to confine plasma and to enhance flow conductance | Kallol Bera, Yan Ye, Michael Kutney, Douglas A. Buchberger, Jr. | 2010-03-09 |
| 7620511 | Method for determining plasma characteristics | Steven C. Shannon, Jeremiah T. Pender, Tarreg Mawari | 2009-11-17 |
| 7618516 | Method and apparatus to confine plasma and to enhance flow conductance | Kallol Bera, Yan Ye, Michael Kutney, Douglas A. Buchberger, Jr. | 2009-11-17 |
| 7585685 | Method of determining wafer voltage in a plasma reactor from applied bias voltage and current and a pair of constants | — | 2009-09-08 |
| 7585384 | Apparatus and method to confine plasma and reduce flow resistance in a plasma reactor | Kallol Bera, Yan Ye, James D. Carducci, Steven C. Shannon, Douglas A. Buchberger, Jr. | 2009-09-08 |
| 7554334 | Matching network characterization using variable impedance analysis | Steven C. Shannon, Steven Lane, Walter R. Merry, Jivko Dinev | 2009-06-30 |
| 7553679 | Method of determining plasma ion density, wafer voltage, etch rate and wafer current from applied bias voltage and current | — | 2009-06-30 |
| 7540971 | Plasma etch process using polymerizing etch gases across a wafer surface and additional polymer managing or controlling gases in independently fed gas zones with time and spatial modulation of gas content | Kallol Bera, Xiaoye Zhao, Kenny L. Doan, Ezra Robert Gold, Paul Brillhart +2 more | 2009-06-02 |
| 7541292 | Plasma etch process with separately fed carbon-lean and carbon-rich polymerizing etch gases in independent inner and outer gas injection zones | Kallol Bera, Xiaoye Zhao, Kenny L. Doan, Ezra Robert Gold, Paul Brillhart +2 more | 2009-06-02 |
| 7521370 | Method of operating a plasma reactor chamber with respect to two plasma parameters selected from a group comprising ion density, wafer voltage, etch rate and wafer current, by controlling chamber parameters of source power and bias power | — | 2009-04-21 |
| 7510665 | Plasma generation and control using dual frequency RF signals | Steven C. Shannon, Alexander Paterson, Theodoros Panagopoulos, John Holland, Dennis S. Grimard | 2009-03-31 |
| 7479456 | Gasless high voltage high contact force wafer contact-cooling electrostatic chuck | Douglas A. Buchberger, Jr., Kartik Ramaswamy, Andrew Nguyen, Hiorji Hanawa, Kenneth S. Collins +1 more | 2009-01-20 |
| 7470626 | Method of characterizing a chamber based upon concurrent behavior of selected plasma parameters as a function of source power, bias power and chamber pressure | Ezra Robert Gold | 2008-12-30 |
| 7452824 | Method of characterizing a chamber based upon concurrent behavior of selected plasma parameters as a function of plural chamber parameters | Ezra Robert Gold | 2008-11-18 |
| 7440859 | Method for determining plasma characteristics | Steven C. Shannon, Jeremiah T. Pender, Tarreg Mawari | 2008-10-21 |
| 7431859 | Plasma etch process using polymerizing etch gases with different etch and polymer-deposition rates in different radial gas injection zones with time modulation | Kallol Bera, Xiaoye Zhao, Kenny L. Doan, Ezra Robert Gold, Paul Brillhart +2 more | 2008-10-07 |
| 7375947 | Method of feedback control of ESC voltage using wafer voltage measurement at the bias supply output | Jang-Gyoo Yang, Steven C. Shannon, Douglas H. Burns, Wonseok Lee, Kwang Soo Kim | 2008-05-20 |
| 7359177 | Dual bias frequency plasma reactor with feedback control of E.S.C. voltage using wafer voltage measurement at the bias supply output | Jang-Gyoo Yang, Steven C. Shannon, Douglas H. Burns, Wonseok Lee, Kwang Soo Kim | 2008-04-15 |
| 7286948 | Method for determining plasma characteristics | Steven C. Shannon, Jeremiah T. Pender, Tarreg Mawari | 2007-10-23 |
| 7247218 | Plasma density, energy and etch rate measurements at bias power input and real time feedback control of plasma source and bias power | — | 2007-07-24 |
| 7221553 | Substrate support having heat transfer system | Andrew Nguyen, Wing Cheng, Hiroji Hanawa, Semyon L. Kats, Kartik Ramaswamy +4 more | 2007-05-22 |
| 7196283 | Plasma reactor overhead source power electrode with low arcing tendency, cylindrical gas outlets and shaped surface | Douglas A. Buchberger, Jr., Olga Regelman, James D. Carducci, Keiji Horioka, Jang-Gyoo Yang | 2007-03-27 |
| 7186943 | MERIE plasma reactor with overhead RF electrode tuned to the plasma with arcing suppression | Yan Ye, Dan Katz, Douglas A. Buchberger, Jr., Xiaoye Zhao, Kang-Lie Chiang +2 more | 2007-03-06 |