Issued Patents All Time
Showing 126–150 of 213 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10600684 | Ultra-thin diffusion barriers | Susmit Singha Roy, Yihong Chen, Srinivas Gandikota | 2020-03-24 |
| 10580642 | Two-step process for silicon gapfill | Pramit Manna, Shishi Jiang | 2020-03-03 |
| 10573555 | Methods of producing self-aligned grown via | Ying Zhang, Regina Freed, Nitin K. Ingle, Ho-yung David Hwang, Uday Mitra | 2020-02-25 |
| 10559497 | Seamless tungsten fill by tungsten oxidation-reduction | Yong Wu, Yihong Chen, Shishi Jiang, Ziqing Duan, Srinivas Gandikota | 2020-02-11 |
| 10559465 | Pre-treatment approach to improve continuity of ultra-thin amorphous silicon film on silicon oxide | Rui Cheng, Yi Yang, Yihong Chen, Karthik Janakiraman | 2020-02-11 |
| 10553485 | Methods of producing fully self-aligned vias and contacts | Ying Zhang, Regina Freed, Nitin K. Ingle, Ho-yung David Hwang, Uday Mitra +1 more | 2020-02-04 |
| 10529568 | PECVD tungsten containing hardmask films and methods of making | Susmit Singha Roy, Pramit Manna, Rui Cheng | 2020-01-07 |
| 10529585 | Dry stripping of boron carbide hardmask | Pramit Manna, Shishi Jiang, Kurtis Leschkies | 2020-01-07 |
| 10522404 | Fully self-aligned via | Ying Zhang, Regina Freed, Nitin K. Ingle, Uday Mitra, Ho-yung David Hwang | 2019-12-31 |
| 10510602 | Methods of producing self-aligned vias | Ying Zhang, Yung-Chen Lin, Qingjun Zhou, He Ren, Ho-yung David Hwang +1 more | 2019-12-17 |
| 10510589 | Cyclic conformal deposition/anneal/etch for Si gapfill | Rui Cheng, Yi Yang | 2019-12-17 |
| 10510546 | Schemes for selective deposition for patterning applications | Atashi Basu | 2019-12-17 |
| 10490411 | Method for enabling self-aligned lithography on metal contacts and selective deposition using free-standing vertical carbon structures | Kurtis Leschkies, Steven Verhaverbeke, Ziqing Duan | 2019-11-26 |
| 10480066 | Metal deposition methods | Yong Wu, Srinivas Gandikota | 2019-11-19 |
| 10483102 | Surface modification to improve amorphous silicon gapfill | Pramit Manna, Shishi Jiang | 2019-11-19 |
| 10480074 | Apparatus for radical-based deposition of dielectric films | Jianhua Zhou, Juan Carlos Rocha-Alvarez, Yihong Chen, Oscar Lopez, Ningli Liu | 2019-11-19 |
| 10475642 | Doped and undoped vanadium oxides for low-k spacer applications | Eswaranand Venkatasubramanian, Srinivas Gandikota, Kelvin Chan, Atashi Basu | 2019-11-12 |
| 10460933 | Two-step process for gapfilling high aspect ratio trenches with amorphous silicon film | Pramit Manna, Shishi Jiang, Rui Cheng | 2019-10-29 |
| 10460936 | Photo-assisted deposition of flowable films | Brian Saxton Underwood, Mukund Srinivasan, Juan Carlos Rocha-Alvarez | 2019-10-29 |
| 10424507 | Fully self-aligned via | Ying Zhang, Regina Freed, Nitin K. Ingle, Uday Mitra, Ho-yung David Hwang | 2019-09-24 |
| 10410872 | Borane mediated dehydrogenation process from silane and alkylsilane species for spacer and hardmask application | Rui Cheng, Ziqing Duan, Milind Gadre, Praket P. Jha, Deenesh Padhi | 2019-09-10 |
| 10410865 | Methods of forming self-aligned vias | David Thompson, Benjamin Schmiege, Jeffrey W. Anthis, Susmit Singha Roy, Ziqing Duan +3 more | 2019-09-10 |
| 10410864 | Hybrid carbon hardmask for lateral hardmask recess reduction | Thomas Jongwan Kwon, Rui Cheng, Er-Xuan Ping, Jaesoo Ahn | 2019-09-10 |
| 10410921 | Fully self-aligned via | Ying Zhang, Regina Freed, Nitin K. Ingle, Uday Mitra, Ho-yung David Hwang | 2019-09-10 |
| 10410869 | CVD based oxide-metal multi structure for 3D NAND memory devices | Susmit Singha Roy, Kelvin Chan, Hien Minh Le, Sanjay Kamath, Srinivas Gandikota +1 more | 2019-09-10 |