Issued Patents All Time
Showing 176–200 of 213 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9640400 | Conformal doping in 3D si structure using conformal dopant deposition | Rui Cheng, Srinivas Gandikota, Pramit Manna | 2017-05-02 |
| 9624577 | Deposition of metal doped amorphous carbon film | Pramit Manna, Mukund Srinivasan, Rui Cheng | 2017-04-18 |
| 9613908 | Ultra-thin dielectric diffusion barrier and etch stop layer for advanced interconnect applications | Deenesh Padhi, Yihong Chen, Kelvin Chan, Alexandros T. Demos, Mukund Srinivasan | 2017-04-04 |
| 9583332 | Low temperature cure modulus enhancement | Pramit Manna, Kiran V. Thadani | 2017-02-28 |
| 9583333 | Low temperature silicon nitride films using remote plasma CVD technology | Amit Chatterjee, Nitin K. Ingle | 2017-02-28 |
| 9514932 | Flowable carbon for semiconductor processing | Nitin K. Ingle | 2016-12-06 |
| 9508545 | Selectively lateral growth of silicon oxide thin film | Yihong Chen, Kelvin Chan, Shaunak Mukherjee | 2016-11-29 |
| 9417515 | Ultra-smooth layer ultraviolet lithography mirrors and blanks, and manufacturing and lithography systems therefor | Soumendra N. Barman, Cara Beasley, Ralf Hofmann, Nitin K. Ingle | 2016-08-16 |
| 9412613 | Development of high etch selective hardmask material by ion implantation into amorphous carbon films | Pramit Manna, Ludovic Godet, Yongmei Chen, Jun Xue, Mukund Srinivasan +2 more | 2016-08-09 |
| 9406509 | Deposition of heteroatom-doped carbon films | Pramit Manna, Mukund Srinivasan | 2016-08-02 |
| 9390914 | Wet oxidation process performed on a dielectric material formed from a flowable CVD process | Linlin Wang, Nitin K. Ingle | 2016-07-12 |
| 9384950 | Chamber coatings | Ren-Guan Duan, Juan Carlos Rocha-Alvarez, Jianhua Zhou, Ningli Liu, Yihong Chen +1 more | 2016-07-05 |
| 9368448 | Metal-containing films as dielectric capping barrier for advanced interconnects | Yihong Chen, Mehul Naik, Srinivas D. Nemani | 2016-06-14 |
| 9362107 | Flowable low-k dielectric gapfill treatment | Kiran V. Thadani, Sanjay Kamath | 2016-06-07 |
| 9343293 | Flowable silicon—carbon—oxygen layers for semiconductor processing | Brian Saxton Underwood, Nitin K. Ingle | 2016-05-17 |
| 9318383 | Integrated cluster to enable next generation interconnect | Mehul Naik, Kiran V. Thadani, Zhenjiang Cui | 2016-04-19 |
| 9257330 | Ultra-thin structure to protect copper and method of preparation | Amit Chatterjee, Geetika Bajaj, Pramit Manna, He Ren, Tapash Chakraborty +3 more | 2016-02-09 |
| 9184093 | Integrated cluster to enable next generation interconnect | Mehul Naik, Kiran V. Thadani, Zhenjiang Cui | 2015-11-10 |
| 9018108 | Low shrinkage dielectric films | Sukwon Hong, Toan Q. Tran, Jingmei Liang, Nitin K. Ingle | 2015-04-28 |
| 8986557 | HDD patterning using flowable CVD film | Brian Saxton Underwood, Nitin K. Ingle, Roman Gouk, Steven Verhaverbeke | 2015-03-24 |
| 8980382 | Oxygen-doping for non-carbon radical-component CVD films | Nitin K. Ingle, Earl Osman Solis, Nicolay Kovarsky, Olga Lyubimova | 2015-03-17 |
| 8921235 | Controlled air gap formation | Kiran V. Thadani, Jingjing Xu, Joe Griffith Cruz, Nitin K. Ingle, Pravin K. Narwankar | 2014-12-30 |
| 8889566 | Low cost flowable dielectric films | Amit Chatterjee, Nitin K. Ingle, Brian Saxton Underwood, Kiran V. Thadani, Xiaolin Chen +2 more | 2014-11-18 |
| 8871656 | Flowable films using alternative silicon precursors | Nitin K. Ingle | 2014-10-28 |
| 8765573 | Air gap formation | Nitin K. Ingle | 2014-07-01 |