Issued Patents All Time
Showing 51–75 of 110 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6787006 | Operating a magnetron sputter reactor in two modes | Praburam Gopalraja, Jianming Fu, Fusen Chen, Girish Dixit, Wei Wang +1 more | 2004-09-07 |
| 6783639 | Coils for generating a plasma and for sputtering | Jaim Nulman, Sergio Edelstein, Mani Subramani, Howard Grunes, Avi Tepman +2 more | 2004-08-31 |
| 6758947 | Damage-free sculptured coating deposition | Tony P. Chiang, Gongda Yao, Peijun Ding, Fusen Chen, Barry Chin +2 more | 2004-07-06 |
| 6692617 | Sustained self-sputtering reactor having an increased density plasma | Jianming Fu, Peijun Ding | 2004-02-17 |
| 6672864 | Method and apparatus for processing substrates in a system having high and low pressure areas | Hougong Wang, Kenny King-Tai Ngan | 2004-01-06 |
| 6660134 | Feedthrough overlap coil | Praburam Gopalraja, Michael Rosenstein, John C. Forster | 2003-12-09 |
| 6610184 | Magnet array in conjunction with rotating magnetron for plasma sputtering | Peijun Ding, Rong Tao | 2003-08-26 |
| 6599399 | Sputtering method to generate ionized metal plasma using electron beams and magnetic field | Seshadri Ramaswami | 2003-07-29 |
| 6547934 | Reduction of metal oxide in a dual frequency etch chamber | Barney M. Cohen, Gilbert Hausmann, Vijay D. Parkhe | 2003-04-15 |
| 6514390 | Method to eliminate coil sputtering in an ICP source | Fusen Chen, Jaim Nulman | 2003-02-04 |
| 6485618 | Integrated copper fill process | Praburam Gopalraja, Jianming Fu, Fusen Chen, Girish Dixit, Sankaram Athreya +2 more | 2002-11-26 |
| 6451179 | Method and apparatus for enhancing sidewall coverage during sputtering in a chamber having an inductively coupled plasma | Gongda Yao | 2002-09-17 |
| 6451177 | Vault shaped target and magnetron operable in two sputtering modes | Praburam Gopalraja, Jianming Fu, Fusen Chen, Girish Dixit, Wei Wang +1 more | 2002-09-17 |
| 6449525 | Computer system to control multiple step ionized metal plasma deposition process for conformal step coverage | Joanna Liu | 2002-09-10 |
| 6413382 | Pulsed sputtering with a small rotating magnetron | Wei Wang, Praburam Gopalraja, Jianming Fu | 2002-07-02 |
| 6409890 | Method and apparatus for forming a uniform layer on a workpiece during sputtering | Howard Grunes, Praburam Gopalraja, John C. Forster, Ralf Hofmann, Anantha K. Subramani | 2002-06-25 |
| 6399479 | Processes to improve electroplating fill | Fusen Chen, Peijun Ding, Barry Chin, Ashok Sinha | 2002-06-04 |
| 6372633 | Method and apparatus for forming metal interconnects | Dan Maydan, Ashok Sinha, Liang Chen, Roderick C. Mosely, Daniel Carl +3 more | 2002-04-16 |
| 6368469 | Coils for generating a plasma and for sputtering | Jaim Nulman, Sergio Edelstein, Mani Subramani, Howard Grunes, Avi Tepman +2 more | 2002-04-09 |
| 6313027 | Method for low thermal budget metal filling and planarization of contacts vias and trenches | John C. Forster, Tse-Yong Yao | 2001-11-06 |
| D450070 | Sputtering chamber coil | Praburam Gopalraja, Michael Rosenstein, John C. Forster | 2001-11-06 |
| 6277249 | Integrated process for copper via filling using a magnetron and target producing highly energetic ions | Praburam Gopalraja, Jianming Fu, Fusen Chen, Girish Dixit, Sankaram Athreya +2 more | 2001-08-21 |
| 6274008 | Integrated process for copper via filling | Praburam Gopalraja, Jianming Fu, Fusen Chen, Girish Dixit, Sankaram Athreya +2 more | 2001-08-14 |
| 6254746 | Recessed coil for generating a plasma | Anantha K. Subramani, John C. Forster, Bradley O. Stimson, Sergio Edelstein, Howard Grunes +1 more | 2001-07-03 |
| 6238533 | Integrated PVD system for aluminum hole filling using ionized metal adhesion layer | Peter Satitpunwaycha, Gongda Yao, Kenny King-Tai Ngan | 2001-05-29 |