Issued Patents All Time
Showing 26–50 of 110 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8398832 | Coils for generating a plasma and for sputtering | Jaim Nulman, Sergio Edelstein, Mani Subramani, Howard Grunes, Avi Tepman +2 more | 2013-03-19 |
| 8215982 | Electrical connector having reliable connection between LED devices and printed circuit board | Jian Bu | 2012-07-10 |
| 8158511 | Method of depositing a uniform barrier layer and metal seed layer with reduced overhang over a plurality of recessed semiconductor features | Tony P. Chiang, Gongda Yao, Peijun Ding, Fusen Chen, Barry Chin +2 more | 2012-04-17 |
| 7989343 | Method of depositing a uniform metal seed layer over a plurality of recessed semiconductor features | Tony P. Chiang, Gongda Yao, Peijun Ding, Fusen Chen, Barry Chin +2 more | 2011-08-02 |
| 7948771 | Electrical component and method for making the same | Hong-Bo Zhang, Chao-Dong Huang | 2011-05-24 |
| 7795138 | Method of depositing a metal seed layer over recessed feature surfaces in a semiconductor substrate | Tony P. Chiang, Gongda Yao, Peijun Ding, Fusen Chen, Barry Chin +2 more | 2010-09-14 |
| 7736176 | Modular jack assembly having improved connecting terminal | Hong-Bo Zhang, Li-Chun Wu | 2010-06-15 |
| 7687909 | Metal / metal nitride barrier layer for semiconductor device applications | Peijun Ding, Hong Mei Zhang, Xianmin Tang, Praburam Gopalraja, Suraj Rengarajan +7 more | 2010-03-30 |
| 7670172 | Modular jack assembly | Hong-Bo Zhang, Li-Chun Wu | 2010-03-02 |
| 7589016 | Method of depositing a sculptured copper seed layer | Tony P. Chiang, Gongda Yao, Peijun Ding, Fusen Chen, Barry Chin +2 more | 2009-09-15 |
| 7517254 | Modular jack assembly having improved base element | Hong-Bo Zhang, Li-Chun Wu | 2009-04-14 |
| 7510441 | Electrical connector having improved based element | Hong-Bo Zhang, Li-Chun Wu | 2009-03-31 |
| 7485004 | Electrical connector having improved electrical element | Zhi-Jian Liu, Li-Chun Wu | 2009-02-03 |
| 7381639 | Method of depositing a metal seed layer on semiconductor substrates | Tony P. Chiang, Gongda Yao, Peijun Ding, Fusen Chen, Barry Chin +2 more | 2008-06-03 |
| 7294574 | Sputter deposition and etching of metallization seed layer for overhang and sidewall improvement | Peijun Ding, Fuhong Zhang, Hsien-Lung Yang, Michael Miller, Jianming Fu +2 more | 2007-11-13 |
| 7253109 | Method of depositing a tantalum nitride/tantalum diffusion barrier layer system | Peijun Ding, Hong Mei Zhang, Xianmin Tang, Praburam Gopalraja, Suraj Rengarajan +7 more | 2007-08-07 |
| 7090542 | Multi-port modular jack assembly with accurate assemblying means | Qisheg Zheng, Xin Zhang, Kai Lu | 2006-08-15 |
| 7074714 | Method of depositing a metal seed layer on semiconductor substrates | Tony P. Chiang, Gongda Yao, Peijun Ding, Fusen Chen, Barry Chin +2 more | 2006-07-11 |
| 7048837 | End point detection for sputtering and resputtering | Sasson Somekh, Marc Schweitzer, John C. Forster, Roderick C. Mosely, Barry Chin +1 more | 2006-05-23 |
| 7006888 | Semiconductor wafer preheating | Hougong Wang, Kenny King-Tai Ngan | 2006-02-28 |
| 7003006 | Green diode laser | Li-Ning You, Wen-Zhao Zhang, Xian-Wen Zheng, Wen-Hu Xu, Yan Chen +1 more | 2006-02-21 |
| 6991709 | Multi-step magnetron sputtering process | Praburam Gopalraja, Jianming Fu, Fusen Chen, Girish Dixit, Wei Wang +1 more | 2006-01-31 |
| 6960284 | Rotational and reciprocal radial movement of a sputtering magnetron | Jianming Fu, Peijun Ding | 2005-11-01 |
| 6919275 | Method of preventing diffusion of copper through a tantalum-comprising barrier layer | Tony P. Chiang, Gongda Yao, Peijun Ding, Fusen Chen, Barry Chin +2 more | 2005-07-19 |
| 6875321 | Auxiliary magnet array in conjunction with magnetron sputtering | Peijun Ding, Rong Tao | 2005-04-05 |