Issued Patents All Time
Showing 101–110 of 110 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5851344 | Ultrasonic wave assisted contact hole filling | Fusen Chen | 1998-12-22 |
| 5847461 | Integrated circuit structure having contact openings and vias filled by self-extrusion of overlying metal layer | Tse-Yong Yao, Hoa Kieu, Julio Aranovich | 1998-12-08 |
| 5841624 | Cover layer for a substrate support chuck and method of fabricating same | Fusen Chen, Jianming Fu | 1998-11-24 |
| 5780357 | Deposition process for coating or filling re-entry shaped contact holes | Hoa Kieu | 1998-07-14 |
| 5763851 | Slotted RF coil shield for plasma deposition system | John C. Forster, Aihua Chen, Howard Grunes, Robert B. Lowrance, Ralf Hofmann +1 more | 1998-06-09 |
| 5736021 | Electrically floating shield in a plasma reactor | Peijun Ding, Jianming Fu | 1998-04-07 |
| 5685960 | Method for forming aluminum contacts | Jianming Fu | 1997-11-11 |
| 5668055 | Method of filling of contact openings and vias by self-extrusion of overlying compressively stressed matal layer | Tse-Yong Yao, Hoa Kieu, Julio Aranovich | 1997-09-16 |
| 5610103 | Ultrasonic wave assisted contact hole filling | Fusen Chen | 1997-03-11 |
| 5467220 | Method and apparatus for improving semiconductor wafer surface temperature uniformity | — | 1995-11-14 |