Issued Patents All Time
Showing 151–175 of 694 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11908764 | Semiconductor package including a circuit substrate having a cavity and a floor plate embedded in a dielectric material and a semiconductor die disposed in the cavity | Meng-Liang Lin, Po-Yao Chuang, Te-Chi Wong, Shuo-Mao Chen | 2024-02-20 |
| 11901279 | Semiconductor package and method of manufacturing the same | Shih-Ting Hung, Meng-Liang Lin, Yi-Wen Wu, Po-Yao Chuang | 2024-02-13 |
| 11901277 | Semiconductor package and method of manufacturing the same | Shih-Ting Hung, Meng-Liang Lin, Yi-Wen Wu, Po-Yao Chuang | 2024-02-13 |
| 11901307 | Semiconductor device including electromagnetic interference (EMI) shielding and method of manufacture | Po-Yao Chuang, Meng-Wei Chou | 2024-02-13 |
| 11894320 | Semiconductor device package with stress reduction design and method of forming the same | Shu-Shen Yeh, Chin-Hua Wang, Po-Chen Lai, Po-Yao Lin | 2024-02-06 |
| 11887952 | Semiconductor device encapsulated by molding material attached to redistribution layer | Shuo-Mao Chen, Feng-Cheng Hsu | 2024-01-30 |
| 11862606 | Packages with metal line crack prevention design | Chen-Hua Yu, Der-Chyang Yeh, Hsien-Wei Chen, Jie Chen | 2024-01-02 |
| 11862580 | Semiconductor package | Chin-Hua Wang, Shu-Shen Yeh, Yu-Sheng Lin, Po-Yao Lin | 2024-01-02 |
| 11862549 | Semiconductor packages having conductive patterns of redistribution structure having ellipse-like shape | Chia-Kuei Hsu, Ming-Chih Yew, Po-Chen Lai, Chin-Hua Wang, Po-Yao Lin | 2024-01-02 |
| 11862528 | Method for forming semiconductor package | Chin-Hua Wang, Po-Yao Lin, Feng-Cheng Hsu, Wen-Yi Lin, Shu-Shen Yeh | 2024-01-02 |
| 11862469 | Package structure and method of manufacturing the same | Feng-Cheng Hsu, Shuo-Mao Chen | 2024-01-02 |
| 11855009 | Chip package with lid | Shu-Shen Yeh, Chin-Hua Wang, Kuang-Chun Lee, Po-Yao Lin, Shyue-Ter Leu | 2023-12-26 |
| 11855059 | Fan-out package with cavity substrate | Po-Hao Tsai, Techi Wong, Po-Yao Chuang, Meng-Wei Chou, Meng-Liang Lin | 2023-12-26 |
| 11855008 | Stacking via structures for stress reduction | Shu-Shen Yeh, Che-Chia Yang, Chin-Hua Wang, Po-Yao Lin, Chia-Hsiang Lin | 2023-12-26 |
| 11855066 | Semiconductor structure and manufacturing method thereof | Hsiang-Tai Lu, Shuo-Mao Chen, Mill-Jer Wang, Feng-Cheng Hsu, Chao-Hsiang Yang +4 more | 2023-12-26 |
| 11855004 | Package structure | Chia-Kuei Hsu, Ming-Chih Yew, Shu-Shen Yeh, Che-Chia Yang, Po-Yao Lin | 2023-12-26 |
| 11854837 | Semiconductor devices and methods of manufacturing | Po-Chen Lai, Ming-Chih Yew, Po-Yao Lin, Chien-Sheng Chen | 2023-12-26 |
| 11854929 | Semiconductor package and method of forming the same | Yu-Sheng Lin, Chin-Hua Wang, Shu-Shen Yeh, Chien-Hung Chen, Po-Yao Lin | 2023-12-26 |
| 11854955 | Fan-out package with controllable standoff | Po-Hao Tsai, Techi Wong, Meng-Wei Chou, Meng-Liang Lin, Po-Yao Chuang | 2023-12-26 |
| 11854956 | Semiconductor die package with conductive line crack prevention design | Ya Huei Lee, Shu-Shen Yeh, Kuo-Ching Hsu, Shyue-Ter Leu, Po-Yao Lin | 2023-12-26 |
| 11848265 | Semiconductor package with improved interposer structure | Yi-Wen Wu, Techi Wong, Po-Hao Tsai, Po-Yao Chuang, Shih-Ting Hung | 2023-12-19 |
| 11848305 | Semiconductor packages including passive devices and methods of forming same | Po-Yao Chuang, Shuo-Mao Chen | 2023-12-19 |
| 11830859 | Package structures and method for forming the same | Chin-Hua Wang, Shu-Shen Yeh, Po-Chen Lai, Po-Yao Lin | 2023-11-28 |
| 11830745 | 3D packages and methods for forming the same | Tzu-Wei Chiu, Cheng-Hsien Hsieh, Hsien-Pin Hu, Kuo-Ching Hsu, Shang-Yun Hou | 2023-11-28 |
| 11830800 | Metallization structure and package structure | Chia-Kuei Hsu, Ming-Chih Yew, Shu-Shen Yeh, Po-Yao Lin | 2023-11-28 |