Issued Patents All Time
Showing 176–200 of 694 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11824007 | Dual-sided routing in 3D SiP structure | Po-Hao Tsai, Po-Yao Chuang, Meng-Liang Lin, Yi-Wen Wu, Techi Wong | 2023-11-21 |
| 11823991 | Frames stacked on substrate encircling devices and manufacturing method thereof | Chien-Hung Chen, Shu-Shen Yeh, Yu-Sheng Lin, Po-Yao Lin | 2023-11-21 |
| 11823887 | Package structure and method of fabricating the same | Yu-Sheng Lin, Han-Hsiang Huang, Chien-Sheng Chen, Shu-Shen Yeh | 2023-11-21 |
| 11810830 | Chip package structure with cavity in interposer | Feng-Cheng Hsu, Shuo-Mao Chen | 2023-11-07 |
| 11804475 | Semiconductor package for thermal dissipation | Chen-Hua Yu, Der-Chyang Yeh, Hsien-Wei Chen, Cheng-Chieh Hsieh, Ming-Yen Chiu | 2023-10-31 |
| 11804451 | Package structure and method of fabricating the same | Yi-Wen Wu, Shih-Ting Hung, Po-Yao Chuang | 2023-10-31 |
| 11798898 | Package structure | Hsiao-Wen Lee, Hsien-Wen Liu | 2023-10-24 |
| 11798897 | Package structure and methods of manufacturing the same | Shu-Shen Yeh, Po-Yao Lin, Chin-Hua Wang, Chia-Kuei Hsu | 2023-10-24 |
| 11791301 | Chip package structure | Shuo-Mao Chen, Feng-Cheng Hsu | 2023-10-17 |
| 11784148 | Semiconductor package | Chia-Kuei Hsu, Ming-Chih Yew, Po-Hao Tsai, Po-Yao Lin | 2023-10-10 |
| 11784130 | Structure and formation method of package with underfill | Yu-Sheng Lin, Po-Yao Lin, Chin-Hua Wang, Shu-Shen Yeh, Che-Chia Yang | 2023-10-10 |
| 11784061 | Chip package structure and method for forming the same | Yu-Sheng Lin, Po-Yao Lin, Shu-Shen Yeh, Chin-Hua Wang | 2023-10-10 |
| 11764159 | Package with fan-out structures | Po-Hao Tsai, Po-Yao Chuang, Techi Wong | 2023-09-19 |
| 11756928 | Multi-chip packages | Shuo-Mao Chen, Feng-Cheng Hsu, Han-Hsiang Huang, Hsien-Wen Liu, Hsiao-Wen Lee | 2023-09-12 |
| 11756892 | Method for forming chip package structure | Shuo-Mao Chen, Feng-Cheng Hsu, Po-Yao Lin | 2023-09-12 |
| 11756873 | Semiconductor package and manufacturing method thereof | Chia-Kuei Hsu, Ming-Chih Yew, Tsung-Yen Lee, Po-Yao Lin | 2023-09-12 |
| 11756854 | Package structure and method of fabricating the same | Yu-Sheng Lin, Po-Yao Lin, Shu-Shen Yeh, Chin-Hua Wang | 2023-09-12 |
| 11749644 | Semiconductor device with curved conductive lines and method of forming the same | Chia-Kuei Hsu, Ming-Chih Yew, Shu-Shen Yeh, Che-Chia Yang, Po-Yao Lin | 2023-09-05 |
| 11742322 | Integrated fan-out package having stress release structure | Ming-Chih Yew, Po-Chen Lai, Shu-Shen Yeh, Po-Yao Lin | 2023-08-29 |
| 11742298 | Alignment mark design for packages | Li-Hsien Huang, Hsien-Wei Chen, Ching-Wen Hsiao, Der-Chyang Yeh, Chen-Hua Yu | 2023-08-29 |
| 11742220 | Integrated passive device package and methods of forming same | Feng-Cheng Hsu, Shuo-Mao Chen, Jui-Pin Hung | 2023-08-29 |
| 11735572 | Integrated circuit package and method forming same | Shuo-Mao Chen, Feng-Cheng Hsu | 2023-08-22 |
| 11728284 | Chip package structure and method for forming the same | Po-Chen Lai, Chin-Hua Wang, Ming-Chih Yew, Chia-Kuei Hsu, Li-Ling Liao +1 more | 2023-08-15 |
| 11728256 | Reinforcing package using reinforcing patches | Chia-Kuei Hsu, Ming-Chih Yew, Po-Yao Lin, Shuo-Mao Chen, Feng-Cheng Hsu | 2023-08-15 |
| 11728233 | Chip package structure with ring structure and method for forming the same | Shu-Shen Yeh, Po-Yao Lin, Po-Chen Lai, Kuang-Chun Lee, Che-Chia Yang +2 more | 2023-08-15 |