Issued Patents All Time
Showing 226–250 of 694 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11600573 | Structure and formation method of chip package with conductive support elements to reduce warpage | Po-Hao Tsai, Techi Wong, Yi-Wen Wu, Po-Yao Chuang | 2023-03-07 |
| 11594520 | Semiconductor package for thermal dissipation | Chen-Hua Yu, Der-Chyang Yeh, Hsien-Wei Chen, Cheng-Chieh Hsieh, Ming-Yen Chiu | 2023-02-28 |
| 11594477 | Semiconductor package and method of manufacturing semiconductor package | Chia-Kuei Hsu, Ming-Chih Yew, Shu-Shen Yeh, Po-Yao Lin | 2023-02-28 |
| 11574861 | Semiconductor package | Chin-Hua Wang, Shu-Shen Yeh, Yu-Sheng Lin, Po-Yao Lin | 2023-02-07 |
| 11557559 | Package structure | Tsung-Yen Lee, Chin-Hua Wang, Ming-Chih Yew, Po-Yao Lin | 2023-01-17 |
| 11532593 | Embedded stress absorber in package | Chien-Sheng Chen, Po-Yao Lin, Po-Chen Lai, Shu-Shen Yeh | 2022-12-20 |
| 11532569 | Method for manufacturing semiconductor package structure | Jui-Pin Hung, Feng-Cheng Hsu, Shuo-Mao Chen, De-Dui Liao | 2022-12-20 |
| 11532567 | Electric magnetic shielding structure in packages | Chen-Hua Yu, Der-Chyang Yeh, Hsien-Wei Chen, Jie Chen | 2022-12-20 |
| 11532535 | Semiconductor die package with thermal management features and method for forming the same | Yu-Sheng Lin, Po-Yao Lin, Shu-Shen Yeh, Chin-Hua Wang | 2022-12-20 |
| 11532867 | Heterogeneous antenna in fan-out package | Po-Yao Chuang, Po-Hao Tsai | 2022-12-20 |
| 11527474 | Integrated circuit package and method | Po-Hao Tsai, Techi Wong, Meng-Wei Chou, Meng-Liang Lin, Po-Yao Chuang | 2022-12-13 |
| 11527457 | Package structure with buffer layer embedded in lid layer | Shu-Shen Yeh, Yu-Sheng Lin, Ming-Chih Yew, Po-Yao Lin | 2022-12-13 |
| 11508710 | Method of forming semiconductor device package | Po-Yao Lin, Cheng-Yi Hong, Feng-Cheng Hsu, Shuo-Mao Chen, Shu-Shen Yeh +1 more | 2022-11-22 |
| 11488898 | Bump joint structure with distortion and method forming same | Po-Yao Lin | 2022-11-01 |
| 11488842 | Method of making semiconductor device package including conformal metal cap contacting each semiconductor die | Chen-Yu Tsai, Tsung-Shang Wei, Yu-Sheng Lin, Wen-Chih Chiou | 2022-11-01 |
| 11469208 | Method of manufacturing semiconductor package structure | Feng-Cheng Hsu, Shuo-Mao Chen | 2022-10-11 |
| 11456257 | Semiconductor package with dual sides of metal routing | Shuo-Mao Chen, Hsien-Wen Liu, Po-Yao Chuang, Feng-Cheng Hsu, Po-Yao Lin | 2022-09-27 |
| 11450622 | Semiconductor package | Chin-Hua Wang, Shu-Shen Yeh, Yu-Sheng Lin, Po-Yao Lin | 2022-09-20 |
| 11443993 | Chip package structure with cavity in interposer | Feng-Cheng Hsu, Shuo-Mao Chen | 2022-09-13 |
| 11430776 | Semiconductor devices and methods of manufacturing | Yi-Wen Wu, Po-Yao Chuang, Meng-Liang Lin, Techi Wong, Shih-Ting Hung +1 more | 2022-08-30 |
| 11430739 | Structure and formation method of package structure with fan-out structure | Po-Hao Tsai, Hsien-Wen Liu, Meng-Liang Lin, Shih-Yung PENG, Shih-Ting Hung | 2022-08-30 |
| 11424189 | Pad structure design in fan-out package | Chen-Hua Yu, Der-Chyang Yeh, Hsien-Wei Chen | 2022-08-23 |
| 11417620 | Semiconductor device encapsulated by molding material attached to redestribution layer | Shuo-Mao Chen, Feng-Cheng Hsu | 2022-08-16 |
| 11410982 | Semiconductor devices and methods of manufacturing | Chang-Yi Yang, Po-Yao Chuang | 2022-08-09 |
| 11410939 | Chip package with lid | Shu-Shen Yeh, Chin-Hua Wang, Kuang-Chun Lee, Po-Yao Lin, Shyue-Ter Leu | 2022-08-09 |