Issued Patents All Time
Showing 751–775 of 858 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8994181 | Bond pad structure to reduce bond pad corrosion | Ying-Ju Chen, Tsung-Yuan Yu, Shih-Wei Liang | 2015-03-31 |
| 8994176 | Methods and apparatus for package with interposers | Kai-Chiang Wu, Yu-Feng Chen, Chun-Hung Lin, Ming-Kai Liu, Chun-Lin Lu | 2015-03-31 |
| 8987058 | Method for wafer separation | Yu-Peng Tsai, Wen-Hsiung Lu, Cheng-Ting Chen, Ming-Da Cheng, Chung-Shi Liu | 2015-03-24 |
| 8987922 | Methods and apparatus for wafer level packaging | Tsung-Yuan Yu, Wen-Hsiung Lu, Hung-Jen Lin | 2015-03-24 |
| 8987884 | Package assembly and methods for forming the same | — | 2015-03-24 |
| 8981580 | Bond pad structure | Shin-Puu Jeng, Yu-Wen Liu, Hao-Yi Tsai | 2015-03-17 |
| 8969191 | Mechanisms for forming package structure | — | 2015-03-03 |
| 8970001 | Guard ring design for maintaining signal integrity | Mirng-Ji Lii, Hao-Yi Tsai, Hung-Yi Kuo | 2015-03-03 |
| 8963328 | Reducing delamination between an underfill and a buffer layer in a bond structure | Ching-Jung Yang, Chang-Pin Huang, Tzuan-Horng Liu, Michael Shou-Ming Tong, Ying-Ju Chen +3 more | 2015-02-24 |
| 8957503 | Chip package and method of manufacturing the same | Chung-Ying Yang, Tsung-Yuan Yu, Shih-Wei Liang | 2015-02-17 |
| 8952530 | Post passivation interconnect structures and methods for forming the same | Ying-Ju Chen | 2015-02-10 |
| 8916465 | UBM structures for wafer level chip scale packaging | Tsung-Yuan Yu, Ying-Ju Chen, Shih-Wei Liang | 2014-12-23 |
| 8912668 | Electrical connections for chip scale packaging | Shih-Wei Liang | 2014-12-16 |
| 8907478 | Bump pad structure | Hao-Yi Tsai, Yu-Wen Liu, Ying-Ju Chen, Hsiu-Ping Wei | 2014-12-09 |
| 8907469 | Integrated circuit package assembly and method of forming the same | — | 2014-12-09 |
| 8901730 | Methods and apparatus for package on package devices | Ming-Kai Liu, Shih-Wei Liang, Kai-Chiang Wu | 2014-12-02 |
| 8884400 | Capacitor in Post-Passivation structures and methods of forming the same | Hao-Yi Tsai, Hung-Yi Kuo, Tung-Liang Shao, Ying-Ju Chen, Tsung-Yuan Yu +1 more | 2014-11-11 |
| 8871629 | Methods of and semiconductor devices with ball strength improvement | Tsung-Yuan Yu, Ying-Ju Chen, Shih-Wei Liang | 2014-10-28 |
| 8860208 | Heat spreader structures in scribe lines | Yu-Wen Liu, Jyh-Cherng Sheu, Hao-Yi Tsai, Shin-Puu Jeng, Chen-Hua Yu +1 more | 2014-10-14 |
| 8836084 | Structure for reducing integrated circuit corner peeling | Yu-Wen Liu, Hao-Yi Tsai | 2014-09-16 |
| 8810025 | Reinforcement structure for flip-chip packaging | Yu-Wen Liu, Ching-Jung Yang, Hsin-Yu Pan, Chao-Wen Shih | 2014-08-19 |
| 8796686 | Integrated circuits with leakage current test structure | Chung-Ying Yang | 2014-08-05 |
| 8786081 | Method and device for circuit routing by way of under-bump metallization | — | 2014-07-22 |
| 8786054 | Structure for integrated circuit alignment | Yu-Chyi Harn, Sophia Wang, Chun-Hung Lin, Ming-Yen Chiu | 2014-07-22 |
| 8779556 | Structure designs and methods for integrated circuit alignment | — | 2014-07-15 |