Issued Patents All Time
Showing 776–800 of 858 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8772151 | Passivation scheme | — | 2014-07-08 |
| 8772137 | Semiconductor wafer with assisting dicing structure and dicing method thereof | Shih-Hsun Hsu | 2014-07-08 |
| 8754508 | Structure to increase resistance to electromigration | Hung-Jui Kuo | 2014-06-17 |
| 8749020 | Metal e-fuse structure design | Hao-Yi Tsai, Shin-Puu Jeng, Shih-Hsun Hsu | 2014-06-10 |
| 8749043 | Package on package structure | Chen-Hua Yu, Mirng-Ji Lii, Hao-Yi Tsai, Kai-Chiang Wu | 2014-06-10 |
| 8748305 | Pad structure for semiconductor devices | — | 2014-06-10 |
| 8749027 | Robust TSV structure | Shin-Puu Jeng, Hung-Jung Tu, Wen-Chih Chiou | 2014-06-10 |
| 8723325 | Structure and method of forming a pad structure having enhanced reliability | Ying-Ju Chen | 2014-05-13 |
| 8722529 | Double solid metal pad with reduced area | Yu-Wen Liu, Hao-Yi Tsai, Shin-Puu Jeng, Ying-Ju Chen | 2014-05-13 |
| 8710630 | Mechanisms for marking the orientation of a sawed die | — | 2014-04-29 |
| 8692378 | UBM structures for wafer level chip scale packaging | Tsung-Yuan Yu, Ying-Ju Chen, Shih-Wei Liang | 2014-04-08 |
| 8669651 | Package-on-package structures with reduced bump bridging | Chung-Ying Yang, Chao-Wen Shih, Hao-Yi Tsai, Mirng-Ji Lii, Tzuan-Horng Liu | 2014-03-11 |
| 8648444 | Wafer scribe line structure for improving IC reliability | Hao-Yi Tsai, Shin-Puu Jeng, Yu-Wen Liu | 2014-02-11 |
| 8629532 | Semiconductor wafer with assisting dicing structure and dicing method thereof | Shih-Hsun Hsu | 2014-01-14 |
| 8624359 | Wafer level chip scale package and method of manufacturing the same | Chung-Ying Yang, Tsung-Yuan Yu, Shih-Wei Liang | 2014-01-07 |
| 8624391 | Chip design with robust corner bumps | — | 2014-01-07 |
| 8618673 | Package structures | Benson Liu, Shin-Puu Jeng, Hao-Yi Tsai | 2013-12-31 |
| 8618827 | Measurement of electrical and mechanical characteristics of low-K dielectric in a semiconductor device | Tung-Liang Shao, Shih-Wei Liang, Ying-Ju Chen, Ching-Jung Yang, Hao-Yi Tsai +2 more | 2013-12-31 |
| 8610267 | Reducing delamination between an underfill and a buffer layer in a bond structure | Ching-Jung Yang, Chang-Pin Huang, Tzuan-Horng Liu, Michael Shou-Ming Tong, Ying-Ju Chen +3 more | 2013-12-17 |
| 8581400 | Post-passivation interconnect structure | Shih-Wei Liang, Ying-Ju Chen, Tsung-Yuan Yu, Mirng-Ji Lii | 2013-11-12 |
| 8581250 | Method and apparatus of fabricating a pad structure for a semiconductor device | — | 2013-11-12 |
| 8581389 | Uniformity control for IC passivation structure | Tsung-Yuan Yu | 2013-11-12 |
| 8581423 | Double solid metal pad with reduced area | Yu-Wen Liu, Hao-Yi Tsai, Shin-Puu Jeng, Ying-Ju Chen | 2013-11-12 |
| 8569886 | Methods and apparatus of under bump metallization in packaging semiconductor devices | Chia-Wei Tu, Yian-Liang Kuo, Tsung-Fu Tsai, Ru-Ying Huang, Ming-Song Sheu | 2013-10-29 |
| D688238 | Notebook computer | Chung-Hao Hsu, Cheng-Nan Ling, Chun-I Chen, Yi-Ta Huang | 2013-08-20 |