Issued Patents All Time
Showing 726–750 of 858 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9196532 | Integrated circuit packages and methods for forming the same | Chia-Wei Tu, Yian-Liang Kuo, Wen-Hsiung Lu, Tsung-Fu Tsai | 2015-11-24 |
| 9196586 | Semiconductor package including an embedded surface mount device and method of forming the same | Ying-Ju Chen, Ming-Yen Chiu, Der-Chyang Yeh | 2015-11-24 |
| 9171811 | Bump pad structure | Hao-Yi Tsai, Yu-Wen Liu, Ying-Ju Chen, Hsiu-Ping Wei | 2015-10-27 |
| 9136235 | Methods and apparatus of packaging semiconductor devices | Chia-Wei Tu, Yian-Liang Kuo, Tsung-Fu Tsai, Ru-Ying Huang, Ming-Song Sheu | 2015-09-15 |
| 9136318 | Capacitor in post-passivation structures and methods of forming the same | Hao-Yi Tsai, Hung-Yi Kuo, Tung-Liang Shao, Ying-Ju Chen, Tsung-Yuan Yu +1 more | 2015-09-15 |
| 9129816 | Contact test structure and method | Jie Chen, Tsung-Yuan Yu, Ying-Ju Chen | 2015-09-08 |
| 9123601 | Package on package structure | Chen-Hua Yu, Mirng-Ji Lii, Hao-Yi Tsai, Kai-Chiang Wu | 2015-09-01 |
| 9122454 | Hinge module and electronic device | Cheng-Nan Ling, Yi-Ta Huang | 2015-09-01 |
| 9123824 | Method of forming an integrated circuit package | — | 2015-09-01 |
| 9117831 | Seal ring structure for integrated circuit chips | Ching-Jung Yang, Yu-Wen Liu, Michael Shou-Ming Tong, Chung-Ying Yang, Tsung-Yuan Yu | 2015-08-25 |
| 9110634 | Electronic apparatus | Yi-Ta Huang, Cheng-Nan Ling | 2015-08-18 |
| 9105588 | Semiconductor component having a second passivation layer having a first opening exposing a bond pad and a plurality of second openings exposing a top surface of an underlying first passivation layer | Ying-Ju Chen | 2015-08-11 |
| 9099485 | Methods and apparatus of guard rings for wafer-level-packaging | Tsung-Yuan Yu | 2015-08-04 |
| 9099318 | Semiconductor chip having different pad width to UBM width ratios and method of manufacturing the same | — | 2015-08-04 |
| 9099420 | Test structures for post-passivation interconnect | Jie Chen | 2015-08-04 |
| 9093411 | Pad structure having contact bars extending into substrate and wafer having the pad structure | Ying-Ju Chen, Hao-Yi Tsai, Mirng-Ji Lii | 2015-07-28 |
| 9086849 | Electronic equipment | Yi-Ta Huang, Cheng-Nan Ling | 2015-07-21 |
| 9082870 | Methods and apparatus of packaging semiconductor devices | Chun-Lin Lu, Kai-Chiang Wu, Hung-Jui Kuo | 2015-07-14 |
| 9076798 | Dicing structures for semiconductor substrates and methods of fabrication thereof | — | 2015-07-07 |
| 9064939 | Methods of making integrated circuits | Chung-Ying Yang | 2015-06-23 |
| 9048149 | Self-alignment structure for wafer level chip scale package | Yu-Chia Lai, Hsien-Ming Tu, Tung-Liang Shao, Chang-Pin Huang, Ching-Jung Yang | 2015-06-02 |
| 9041215 | Single mask package apparatus and method | Chen-Hua Yu, Mirng-Ji Lii, Hao-Yi Tsai, Hung-Yi Kuo | 2015-05-26 |
| 9013038 | Semiconductor device with post-passivation interconnect structure and method of forming the same | Tsung-Yuan Yu, Hao-Yi Tsai, Mirng-Ji Lii, Chen-Hua Yu | 2015-04-21 |
| 9006891 | Method of making a semiconductor device having a post-passivation interconnect structure | Shih-Wei Liang, Ying-Ju Chen, Tsung-Yuan Yu, Mirng-Ji Lii | 2015-04-14 |
| 9000876 | Inductor for post passivation interconnect | Hao-Yi Tsai, Hung-Yi Kuo, Jie Chen, Ying-Ju Chen, Tsung-Yuan Yu | 2015-04-07 |