Issued Patents All Time
Showing 701–725 of 858 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9318444 | Structure designs and methods for integrated circuit alignment | — | 2016-04-19 |
| 9318456 | Self-alignment structure for wafer level chip scale package | Yu-Chia Lai, Hsien-Ming Tu, Tung-Liang Shao, Chang-Pin Huang, Ching-Jung Yang | 2016-04-19 |
| 9318442 | Integrated fan-out package with dummy vias | — | 2016-04-19 |
| 9318452 | Semiconductor packages and methods of forming the same | Jie Chen | 2016-04-19 |
| 9312193 | Stress relief structures in package assemblies | — | 2016-04-12 |
| 9305856 | Post-passivation interconnect structure AMD method of forming same | Yi-Wen Wu | 2016-04-05 |
| 9293442 | Semiconductor package and method | An-Jhih Su | 2016-03-22 |
| 9293606 | Semiconductor device with seal ring with embedded decoupling capacitor | Kuo-Ji Chen, Wei Ma, Ta-Pen Guo, Hao-Yi Tsai | 2016-03-22 |
| 9287246 | Package assembly and methods for forming the same | — | 2016-03-15 |
| 9287143 | Apparatus for package reinforcement using molding underfill | Tsung-Yuan Yu, Wen-Hsiung Lu, Ming-Da Cheng, Hao-Yi Tsai, Mirng-Ji Lii +1 more | 2016-03-15 |
| 9281234 | WLCSP interconnect apparatus and method | Jie Chen | 2016-03-08 |
| 9275925 | System and method for an improved interconnect structure | Hao-Yi Tsai, Mirng-Ji Lii, Chen-Hua Yu, Tsung-Yuan Yu | 2016-03-01 |
| 9269658 | Ball amount process in the manufacturing of integrated circuit | Tsung-Yuan Yu, Wen-Hsiung Lu, Ming-Da Cheng | 2016-02-23 |
| 9269682 | Method of forming bump structure | Tsung-Yuan Yu, Ying-Ju Chen | 2016-02-23 |
| 9269675 | Semiconductor device and manufacturing method thereof | Ying-Ju Chen | 2016-02-23 |
| 9263354 | Pillar structure having cavities | Ying-Ju Chen | 2016-02-16 |
| 9257333 | Interconnect structures and methods of forming same | Wen-Hsiung Lu, Hsuan-Ting Kuo, Tsung-Yuan Yu, Ming-Da Cheng, Chung-Shi Liu | 2016-02-09 |
| 9245842 | Semiconductor devices having guard ring structure and methods of manufacture thereof | Nien-Fang Wu, Hung-Yi Kuo, Jie Chen, Ying-Ju Chen, Tsung-Yuan Yu | 2016-01-26 |
| 9240387 | Wafer-level chip scale package with re-workable underfill | Tsung-Ding Wang, Chien-Hsiun Lee, Hao-Yi Tsai, Mirng-Ji Lii, Chen-Hua Yu | 2016-01-19 |
| 9240294 | Touch pad module having a circuit board including a recessed area and electronic device using the same | Chia-Chieh Liu, Wen-Chieh Tai, Cheng-Nan Ling, Chun-I Chen, Yi-Ta Huang | 2016-01-19 |
| 9236322 | Methods and apparatus for heat spreader on silicon | Chung-Ying Yang, Chao-Wen Shih, Kai-Chiang Wu | 2016-01-12 |
| 9224678 | Method and apparatus for connecting packages onto printed circuit boards | — | 2015-12-29 |
| 9224680 | Electrical connections for chip scale packaging | Shih-Wei Liang | 2015-12-29 |
| 9224709 | Semiconductor device including an embedded surface mount device and method of forming the same | Ying-Ju Chen | 2015-12-29 |
| 9196529 | Contact pad for semiconductor devices | Jie Chen, Ying-Ju Chen | 2015-11-24 |