Issued Patents All Time
Showing 801–825 of 858 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| D686154 | External battery | Chung-Hao Hsu, Cheng-Nan Ling, Chun-I Chen, Yi-Ta Huang | 2013-07-16 |
| 8450126 | Semiconductor test pad structures | Ying-Ju Chen, Yu-Wen Liu, Hao-Yi Tsai, Shin-Puu Jeng | 2013-05-28 |
| 8436472 | Corner stress release structure design for increasing circuit routing areas | — | 2013-05-07 |
| 8434041 | Increasing dielectric strength by optimizing dummy metal distribution | Tzuan-Horng Liu | 2013-04-30 |
| 8426855 | Pad structure having a metalized region and a non-metalized region | — | 2013-04-23 |
| 8405211 | Bump pad structure | Hao-Yi Tsai, Yu-Wen Liu, Ying-Ju Chen, Hsiu-Ping Wei | 2013-03-26 |
| 8395239 | Grounded seal ring structure in semiconductor devices | Chung-Ying Yang | 2013-03-12 |
| 8373254 | Structure for reducing integrated circuit corner peeling | Yu-Wen Liu, Hao-Yi Tsai | 2013-02-12 |
| 8368180 | Scribe line metal structure | Chen-Hua Yu, Shin-Puu Jeng, Hao-Yi Tsai, Shang-Yun Hou, Ming-Yen Chiu | 2013-02-05 |
| 8334582 | Protective seal ring for preventing die-saw induced stress | Shin-Puu Jeng, Shang-Yun Hou, Hao-Yi Tsai, Anbiarshy Wu, Yu-Wen Liu | 2012-12-18 |
| 8294264 | Radiate under-bump metallization structure for semiconductor devices | Tzu-Yu Wang, Chi-Chun Hsieh, An-Jhih Su, Shin-Puu Jeng, Liwei Lin | 2012-10-23 |
| 8278737 | Structure for improving die saw quality | Hao-Yi Tsai, Ying-Ju Chen, Yu-Wen Liu, Shin-Puu Jeng | 2012-10-02 |
| 8253217 | Seal ring structure in semiconductor devices | Chung-Ying Yang | 2012-08-28 |
| 8237160 | Probe pad on a corner stress relief region in a semiconductor chip | Chung-Ying Yang, Ying-Ju Chen, Shih-Wei Liang, Ching-Jung Yang | 2012-08-07 |
| 8237253 | Package structures | Benson Liu, Shin-Puu Jeng, Hao-Yi Tsai | 2012-08-07 |
| 8227916 | Package structure and method for reducing dielectric layer delamination | Hsiu-Ping Wei, Shin-Puu Jeng, Hao-Yi Tsai, Yu-Wen Liu, Ying-Ju Chen +1 more | 2012-07-24 |
| 8227917 | Bond pad design for fine pitch wire bonding | Shih-Hsun Hsu, Hao-Yi Tsai, Benson Liu, Chia-Lun Tsai, Anbiarshy Wu +2 more | 2012-07-24 |
| 8217499 | Structure to reduce etching residue | Tsung-Yuan Yu, Chung-Ying Yang | 2012-07-10 |
| 8217394 | Probe pad on a corner stress relief region in a semiconductor chip | Chung-Ying Yang | 2012-07-10 |
| 8212330 | Process for improving the reliability of interconnect structures and resulting structure | Jian-Hong Lin, Tzu-Li Lee | 2012-07-03 |
| 8203209 | Bond pad design for reducing the effect of package stress | Chen-Hua Yu, Shin-Puu Jeng, Hao-Yi Tsai | 2012-06-19 |
| 8178980 | Bond pad structure | Shin-Puu Jeng, Yu-Wen Liu, Hao-Yi Tsai | 2012-05-15 |
| 8174124 | Dummy pattern in wafer backside routing | Ming-Yen Chiu, Ming-Fa Chen, Shin-Puu Jeng | 2012-05-08 |
| 8125233 | Parametric testline with increased test pattern areas | Shih-Hsun Hsu, Hao-Yi Tsai, Shin-Puu Jeng | 2012-02-28 |
| 8072076 | Bond pad structures and integrated circuit chip having the same | Shih-Hsun Hsu, Shih-Puu Jeng, Shang-Yun Hou | 2011-12-06 |