Issued Patents All Time
Showing 851–858 of 858 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7420277 | System for heat dissipation in semiconductor devices | Jiun-Lin Yeh, Shin-Puu Jeng, Yi-Lung Cheng | 2008-09-02 |
| 7378720 | Integrated stress relief pattern and registration structure | Chung-Min Fu, Huang-Sheng Lin, Yu-Chyi Harn | 2008-05-27 |
| 7361972 | Chip packaging structure for improving reliability | — | 2008-04-22 |
| 7348672 | Interconnects with improved reliability | Hsueh-Chung Chen, Shin-Puu Jeng | 2008-03-25 |
| 7235424 | Method and apparatus for enhanced CMP planarization using surrounded dummy design | Hao-Yi Tsai, Hsueh-Chung Chen, Shin-Puu Jeng, Jian-Hong Lin, Chih-Tao Lin +1 more | 2007-06-26 |
| 7224069 | Dummy structures extending from seal ring into active circuit area of integrated circuit chip | — | 2007-05-29 |
| 7202550 | Integrated stress relief pattern and registration structure | Chung-Min Fu, Huang-Sheng Lin, Yu-Chyi Harn | 2007-04-10 |
| 7196428 | Bond pad structure for integrated circuit chip | — | 2007-03-27 |