Issued Patents All Time
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12404170 | Method for producing a bonding pad for a micromechanical sensor element | Andreas Prinzen, Christof Schwenk, Frank Reichenbach, Friedjof Heuck, Nicolas Schorr | 2025-09-02 |
| D990958 | Beverages machine | Damien Regamey | 2023-07-04 |
| D954483 | Beverage machine | Damien Regamey | 2022-06-14 |
| 10889491 | Method for producing a micromechanical element | Markus Kuhnke, Stefan Majoni | 2021-01-12 |
| 10775253 | Method for producing a micromechanical component with an exposed pressure sensor device and micromechanical component | Arne Dannenberg, Daniel Haug, Daniel Kaercher, Michaela Mitschke, Mike Schwarz +1 more | 2020-09-15 |
| 10766778 | Polycrystalline material having low mechanical strain; method for producing a polycrystalline material | Andreas Hartlieb, Jochen Beintner, Juergen Butz | 2020-09-08 |
| 10643896 | Method for producing at least one via in a wafer | Jochen Reinmuth, Markus Kuhnke, Stefan Majoni, Timo Schary | 2020-05-05 |
| 10336610 | Method for producing a micromechanical component | Andreas Scheurle, Hendrik Specht, Marlene Winker, Ralf Hausner, Volker Schmitz | 2019-07-02 |
| 9725300 | Capacitive MEMS-sensor element having bond pads for the electrical contacting of the measuring capacitor electrodes | Arnim Hoechst, Bernhard Gehl, Rolf Scheben, Benedikt Stein | 2017-08-08 |
| 9667419 | System and method for cryptographic key identification | Jorge Guajardo Merchan, Matthew Lewis, Andreas Mueller, Ralf Schellin | 2017-05-30 |
| 9650240 | Component including two semiconductor elements, which are bonded to one another via a structured bonding layer, and method for manufacturing a component of this type | Mirko Hattass, Jochen Reinmuth, Julian Gonska, Johannes Classen | 2017-05-16 |
| 9428378 | Component including two semiconductor elements between which at least two hermetically tightly sealed cavities having different internal pressures are formed and method for manufacturing such a component | Friedjof Heuck, Lars Tebje, Jullian Gonska, Reinhard Neul | 2016-08-30 |
| 9206034 | Micromechanical component having a bond joint | Christoph Duenn, Hans-Peter Baer | 2015-12-08 |
| 8563344 | Method for producing MEMS structures, and MEMS structure | Jochen Reinmuth | 2013-10-22 |
| 8492188 | Method for producing a micromechanical component | Christina Leinenbach, Axel Franke, Jochen Reinmuth, Ando Feyh, Christian Rettig | 2013-07-23 |
| 8402827 | Sensor element and method for operating a sensor element | Axel Grosse | 2013-03-26 |
| 8393215 | Micromechanical acceleration sensor having an open seismic mass | Dietrich Schubert, Lars Tebje | 2013-03-12 |
| 8174082 | Micromechanical component having multiple caverns, and manufacturing method | Frank Fischer, Eckhard Graf, Hartmut Kueppers, Roland Scheuerer | 2012-05-08 |
| 7863072 | Micromechanical diaphragm sensor having a double diaphragm | Matthias Illing, Heribert Weber, Christoph Schelling, Stefan Weiss | 2011-01-04 |
| 7740459 | Micropump having a pump diaphragm and a polysilicon layer | Matthias Fuertsch, Hubert Benzel, Stefan Finkbeiner, Stefan Pinter, Frank Fischer +1 more | 2010-06-22 |
| 7436076 | Micromechanical component having an anodically bonded cap and a manufacturing method | Nicolaus Ulbrich, Rainer Straub | 2008-10-14 |