Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11554952 | Method for closing openings in a flexible diaphragm of a MEMS element | Christoph Hermes, Juergen Butz | 2023-01-17 |
| 11012789 | MEMS microphone system | Christoph Hermes, Arnim Hoechst, Daniel Christoph Meisel, Andrew J. Doller, Yujie Zhang +1 more | 2021-05-18 |
| 10981777 | MEMS transducer system for pressure and acoustic sensing | Andrew J. Doller, Gokhan Hatipoglu, Yujie Zhang, Daniel Christoph Meisel | 2021-04-20 |
| 10934160 | System of non-acoustic sensor combined with MEMS microphone | Andrew J. Doller, Gokhan Hatipoglu, Yujie Zhang, Daniel Christoph Meisel | 2021-03-02 |
| 10793430 | Method for producing thin MEMS wafers | Sebastien Loiseau, Arnim Hoechst, Eugene Moliere Tanguep Njiokep, Sandra Altmannshofer | 2020-10-06 |
| 10555088 | MEMS microphone system having an electrode assembly | Daniel Christoph Meisel, Yujie Zhang, Andrew J. Doller, Gokhan Hatipoglu | 2020-02-04 |
| 10555090 | Microphone with encapsulated moving electrode | Jochen Reinmuth, Vijaye Kumar Rajaraman, Daniel Christoph Meisel | 2020-02-04 |
| 10349188 | MEMS microphone system and method | Daniel Christoph Meisel, Yujie Zhang, Andrew J. Doller, Gokhan Hatipoglu | 2019-07-09 |
| 10183857 | MEMS pressure sensor with multiple membrane electrodes | Andrew Graham, Ando Feyh | 2019-01-22 |
| 9758369 | Method for manufacturing a microphone structure and a pressure sensor structure in the layer structure of a MEMS element | Florian Schoen | 2017-09-12 |
| 9725300 | Capacitive MEMS-sensor element having bond pads for the electrical contacting of the measuring capacitor electrodes | Heiko Stahl, Arnim Hoechst, Rolf Scheben, Benedikt Stein | 2017-08-08 |
| 9369804 | MEMS membrane overtravel stop | Thomas Buck, John W. Zinn, Andy Doller, Brett Diamond | 2016-06-14 |
| 9042581 | Component having a micromechanical microphone structure, and method for manufacturing same | Jochen Zoellin, Axel Grosse | 2015-05-26 |
| 9035307 | Microphone component | Thomas Buck, Florian Schoen | 2015-05-19 |