Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10927004 | Method for bonding wafers eutectically, and a wafer composite | Volker Schmitz | 2021-02-23 |
| 9114975 | Micromechanical component and method for producing a micromechanical component having a thin-layer cap | Volker Schmitz | 2015-08-25 |
| 9042581 | Component having a micromechanical microphone structure, and method for manufacturing same | Jochen Zoellin, Bernhard Gehl | 2015-05-26 |
| 8809095 | Micromechanical component and method for producing a micromechanical component having a thin-layer cap | Volker Schmitz | 2014-08-19 |
| 8530260 | Method for attaching a first carrier device to a second carrier device and micromechanical components | Julian Gonska, Heribert Weber, Ralf Hausner | 2013-09-10 |
| 8402827 | Sensor element and method for operating a sensor element | Heiko Stahl | 2013-03-26 |
| 8304845 | Method for sealing an opening | Udo Bischof, Holger Hoefer, Volker Schmitz, Lutz Mueller, Ralf Hausner | 2012-11-06 |
| 8154094 | Micromechanical component having a cap having a closure | Volker Schmitz | 2012-04-10 |