Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9988261 | Micromechanical device and method for manufacturing a micromechanical device | Jochen Reinmuth, Kathrin Gutsche | 2018-06-05 |
| 9725309 | Micromechanical sensor device and corresponding manufacturing method | Jochen Reinmuth | 2017-08-08 |
| 9670055 | Micromechanical sensor unit and method for manufacturing micromechanical sensor units | Jochen Reinmuth | 2017-06-06 |
| 9650240 | Component including two semiconductor elements, which are bonded to one another via a structured bonding layer, and method for manufacturing a component of this type | Mirko Hattass, Heiko Stahl, Jochen Reinmuth, Johannes Classen | 2017-05-16 |
| 9593011 | Micromechanical component and method for producing a micromechanical component | Heribert Weber | 2017-03-14 |
| 9567212 | Micromechanical component | Jochen Reinmuth, Kathrin Gutsche, Jens Frey, Heribert Weber | 2017-02-14 |
| 9567205 | Micromechanical sensor device with a getter in an enclosed cavity | Jochen Reinmuth | 2017-02-14 |
| 9123716 | Method for bonding two silicon substrates, and a correspondeing system of two silicon substrates | Heribert Weber, Jens Frey, Timo Schary, Thomas Mayer | 2015-09-01 |
| 8975118 | Component having a via and method for manufacturing it | Jens Frey, Heribert Weber, Eckhard Graf, Roman Schlosser | 2015-03-10 |
| 8530260 | Method for attaching a first carrier device to a second carrier device and micromechanical components | Axel Grosse, Heribert Weber, Ralf Hausner | 2013-09-10 |
| 8035209 | Micromechanical device which has cavities having different internal atmospheric pressures | Ralf Hausner | 2011-10-11 |
| 7572660 | Electrical through-plating of semiconductor chips | Hubert Benzel, Stefan Finkbeiner, Christoph Schelling | 2009-08-11 |
| 7495302 | Micromechanical component having a diaphragm | Frank Fischer, Hans Artmann, Lars Metzger, Arnim Hoechst | 2009-02-24 |
| 7026224 | Method for dicing semiconductor chips and corresponding semiconductor chip system | Hubert Benzel | 2006-04-11 |