TS

Timo Schary

Robert Bosch Gmbh: 12 patents #1,246 of 19,740Top 7%
📍 Grötzingen, DE: #4 of 11 inventorsTop 40%
Overall (All Time): #395,271 of 4,157,543Top 10%
12
Patents All Time

Issued Patents All Time

Showing 1–12 of 12 patents

Patent #TitleCo-InventorsDate
12414470 Semiconductor component including a dielectric layer Daniel Monteiro Diniz Reis, Daniel Pantel, Frank Schatz, Jochen Tomaschko, Mathias Mews 2025-09-09
12396366 Semiconductor component including a dielectric layer Daniel Monteiro Diniz Reis, Daniel Pantel, Frank Schatz, Jochen Tomaschko, Mathias Mews 2025-08-19
12266685 Method and device for using a semiconductor component Daniel Monteiro Diniz Reis, Frank Schatz, Mathias Mews 2025-04-01
12256642 Ultrasound transducer with distributed cantilevers Seow Yuen Yee, Vladimir Petkov, Matthias Boecker, Reinhold Roedel 2025-03-18
12150384 Ultrasound transducer with distributed cantilevers Seow Yuen Yee, Vladimir Petkov, Matthias Boecker 2024-11-19
11940618 Micromechanical component and method for producing a micromechanical component Alexander Eberspaecher, Frank Schatz, Janine Riedrich-Moeller, Joerg Muchow, Josip Mihaljevic +2 more 2024-03-26
11897758 Electrical contacting and method for producing an electrical contacting Jochen Reinmuth, Markus Kuhnke, Stefan Majoni 2024-02-13
11870369 Microelectronics device and method for producing a microelectronics device Jochen Tomaschko, Christoph Kaiser, Daniel Monteiro Diniz Reis 2024-01-09
11307404 Micromechanical micromirror array and corresponding operating method Helmut Grutzeck, Joerg Muchow, Philip Kaupmann 2022-04-19
10643896 Method for producing at least one via in a wafer Heiko Stahl, Jochen Reinmuth, Markus Kuhnke, Stefan Majoni 2020-05-05
9123716 Method for bonding two silicon substrates, and a correspondeing system of two silicon substrates Julian Gonska, Heribert Weber, Jens Frey, Thomas Mayer 2015-09-01
9035432 Component having through-hole plating, and method for its production Jochen Reinmuth, Heribert Weber, Yvonne Bergmann 2015-05-19