| 12414470 |
Semiconductor component including a dielectric layer |
Daniel Monteiro Diniz Reis, Daniel Pantel, Frank Schatz, Mathias Mews, Timo Schary |
2025-09-09 |
| 12396366 |
Semiconductor component including a dielectric layer |
Daniel Monteiro Diniz Reis, Daniel Pantel, Frank Schatz, Mathias Mews, Timo Schary |
2025-08-19 |
| 12030773 |
Method for producing a wafer connection |
Friedjof Heuck, Peter Schmollngruber, Thomas Friedrich, Volkmar Senz, Franziska Rohlfing |
2024-07-09 |
| 11870369 |
Microelectronics device and method for producing a microelectronics device |
Christoph Kaiser, Timo Schary, Daniel Monteiro Diniz Reis |
2024-01-09 |
| 10840107 |
Method for forming a cavity and a component having a cavity |
Simon Armbruster, Benjamin Steuer, Stefan Pinter, Dietmar Haberer |
2020-11-17 |
| 10431474 |
Method for forming a cavity and a component having a cavity |
Simon Armbruster, Benjamin Steuer, Stefan Pinter, Dietmar Haberer |
2019-10-01 |
| 9663351 |
Method for producing a wafer equipped with transparent plates |
Simon Armbruster, Dietmar Haberer, Stefan Pinter, Benjamin Steuer |
2017-05-30 |
| 9461234 |
Manufacturing method for a piezoelectric layer arrangement and corresponding piezoelectric layer arrangement |
Thomas Mayer, Juergen Butz, Rainer Straub, Christof Single |
2016-10-04 |
