Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12404170 | Method for producing a bonding pad for a micromechanical sensor element | Andreas Prinzen, Christof Schwenk, Frank Reichenbach, Heiko Stahl, Nicolas Schorr | 2025-09-02 |
| 12160215 | Method for manufacturing a piezoelectric resonator | Marcus Pritschow, Markus Kuhnke, Peter Schmollngruber, Ricardo Zamora, Sebastien Loiseau +3 more | 2024-12-03 |
| 12030773 | Method for producing a wafer connection | Jochen Tomaschko, Peter Schmollngruber, Thomas Friedrich, Volkmar Senz, Franziska Rohlfing | 2024-07-09 |
| 11560302 | Micromechanical pressure sensor with two cavities and diaphragms and corresponding production method | Robert Maul | 2023-01-24 |
| 11486782 | Micromechanical device and method for manufacturing a micromechanical device | Mike Schwarz, Thomas Friedrich, Volkmar Senz | 2022-11-01 |
| 11060937 | Micromechanical pressure sensor | Ferenc Lukacs, Arne Dannenberg, Helmut Grutzeck, Mike Schwarz, Robert Maul +3 more | 2021-07-13 |
| 10753743 | Micromechanical yaw rate sensor and method for the production thereof | Reinhard Neul, Torsten Ohms, Robert Maul, Mirko Hattass, Christian Hoeppner +3 more | 2020-08-25 |
| 10753742 | Micromechanical yaw rate sensor and method for operating same | Reinhard Neul, Torsten Ohms, Robert Maul, Mirko Hattass, Christian Hoeppner +3 more | 2020-08-25 |
| 10217926 | Method for producing a multi-layer electrode system | Tjalf Pirk, Andreas Krauss, Stefan Leidich, Christoph Schelling | 2019-02-26 |
| 10126224 | Particle sensor and method for manufacturing a particle sensor | Achim Trautmann | 2018-11-13 |
| 10012828 | Assembly body for micromirror chips, mirror device and production method for a mirror device | Frank Schatz, Kerrin Doessel, Stefan Pinter, Daniel Pantel, Franziska Rohlfing | 2018-07-03 |
| 9593012 | Method for producing a micromechanical component, and corresponding micromechanical component | Christoph Schelling | 2017-03-14 |
| 9428378 | Component including two semiconductor elements between which at least two hermetically tightly sealed cavities having different internal pressures are formed and method for manufacturing such a component | Lars Tebje, Heiko Stahl, Jullian Gonska, Reinhard Neul | 2016-08-30 |
| 9233841 | Production process for a micromechanical component and micromechanical component | Christoph Schelling, Mirko Hattass, Benjamin Schmidt | 2016-01-12 |