Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12404170 | Method for producing a bonding pad for a micromechanical sensor element | Andreas Prinzen, Frank Reichenbach, Friedjof Heuck, Heiko Stahl, Nicolas Schorr | 2025-09-02 |
| 12094717 | Method for forming a trench in a first semiconductor layer of a multi-layer system | Nicolas Schorr | 2024-09-17 |
| 12031820 | Micromechanical system, method for operating a micromechanical system | Lars Tebje, Johannes Classen, Holger Rumpf, Joerg Braeuer, Torsten Ohms | 2024-07-09 |
| 10059583 | Micro-mechanical component | Achim Breitling, Hartmut Kueppers, Nicole Schittenhelm, Volker Schmitz | 2018-08-28 |