Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12404170 | Method for producing a bonding pad for a micromechanical sensor element | Andreas Prinzen, Christof Schwenk, Frank Reichenbach, Friedjof Heuck, Heiko Stahl | 2025-09-02 |
| 12094717 | Method for forming a trench in a first semiconductor layer of a multi-layer system | Christof Schwenk | 2024-09-17 |
| 11130672 | Micromechanical device and corresponding production method | Johannes Baader, Rainer Straub, Stefan Pinter, Tina Steigert | 2021-09-28 |