Issued Patents All Time
Showing 1–25 of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10843917 | Micromechanical device having a decoupled micromechanical structure | Steffen Zunft, Bonsang Kim, Ando Feyh, Gary O'Brien, Michael Baus +2 more | 2020-11-24 |
| 10317211 | Robust inertial sensors | Bongsang Kim, Ando Feyh, Gary O'Brien, Michael Baus, Ralf Maier +1 more | 2019-06-11 |
| 10184910 | Combined pressure and humidity sensor | Gerhard Lammel, Sibylle Waffenschmidt, Ando Feyh, Gary O'Brien | 2019-01-22 |
| 10183857 | MEMS pressure sensor with multiple membrane electrodes | Ando Feyh, Bernhard Gehl | 2019-01-22 |
| 10175188 | Trench based capacitive humidity sensor | Gary O'Brien, Ando Feyh, Ashwin Samarao, Gary Yama | 2019-01-08 |
| 10173887 | Epi-poly etch stop for out of plane spacer defined electrode | Gary Yama, Gary O'Brien | 2019-01-08 |
| 10160632 | System and method for forming a buried lower electrode in conjunction with an encapsulated MEMS device | Ando Feyh, Gary O'Brien | 2018-12-25 |
| 9588073 | Resistive MEMS humidity sensor | Ando Feyh, Ashwin Samarao, Gary Yama, Gary O'Brien | 2017-03-07 |
| 9511998 | MEMS device having a getter | Ashwin Samarao, Gary O'Brien, Ando Feyh, Gary Yama, Bongsang Kim +1 more | 2016-12-06 |
| 9476779 | Sensor with an embedded thermistor for precise local temperature measurement | Ando Feyh, Gary O'Brien | 2016-10-25 |
| 9469522 | Epi-poly etch stop for out of plane spacer defined electrode | Gary Yama, Gary O'Brien | 2016-10-18 |
| 9455353 | Substrate with multiple encapsulated devices | Po-Jui Chen, Gary Yama, Matthieu Liger | 2016-09-27 |
| 9302906 | Capacitive pressure sensor and method | Ando Feyh | 2016-04-05 |
| 9266716 | MEMS acoustic transducer with silicon nitride backplate and silicon sacrificial layer | Ando Feyh | 2016-02-23 |
| 9242850 | Out-of-plane spacer defined electrode | Gary Yama, Gary O'Brien | 2016-01-26 |
| 9233842 | Passivation layer for harsh environments and methods of fabrication thereof | Ando Feyh, Fabian Purkl, Gary Yama | 2016-01-12 |
| 9159637 | Electronic device with an interlocking mold package | Ando Feyh, Gary O'Brien | 2015-10-13 |
| 9073749 | Structured gap for a MEMS pressure sensor | Gary Yama, Gary O'Brien | 2015-07-07 |
| 9064982 | Thin-film encapsulated infrared sensor | Fabian Purkl, Gary Yama, Ando Feyh, Ashwin Samarao, Gary O'Brien | 2015-06-23 |
| 8933535 | Wafer with spacer including horizontal member | Gary Yama, Gary O'Brien | 2015-01-13 |
| 8906730 | Method of forming membranes with modified stress characteristics | Gary Yama, Gary O'Brien | 2014-12-09 |
| 8890283 | Wafer with recessed plug | Gary Yama, Gary O'Brien | 2014-11-18 |
| 8878314 | MEMS package or sensor package with intra-cap electrical via and method thereof | Gary Yama, Gary O'Brien | 2014-11-04 |
| 8749000 | Pressure sensor with doped electrode | Gary O'Brien | 2014-06-10 |
| 8673756 | Out-of-plane spacer defined electrode | Gary Yama, Gary O'Brien | 2014-03-18 |