Issued Patents All Time
Showing 25 most recent of 32 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12046508 | Method of dielectric material fill and treatment | Shi YOU, He Ren, Naomi Yoshida, Nikolaos Bekiaris, Mehul Naik +2 more | 2024-07-23 |
| 11881411 | High pressure annealing process for metal containing materials | Kaushal K. Singh, Srinivas D. Nemani, Ellie Yieh | 2024-01-23 |
| 11615984 | Method of dielectric material fill and treatment | Shi YOU, He Ren, Naomi Yoshida, Nikolaos Bekiaris, Mehul Naik +2 more | 2023-03-28 |
| 11581183 | Methods of forming amorphous carbon hard mask layers and hard mask layers formed therefrom | Bhargav S. Citla, Srinivas D. Nemani | 2023-02-14 |
| 11566325 | Silicon carbonitride gapfill with tunable carbon content | Bhargav S. Citla, Joshua Rubnitz, Jethro Tannos, Chentsau Chris Ying, Srinivas D. Nemani +1 more | 2023-01-31 |
| 10998200 | High pressure annealing process for metal containing materials | Kaushal K. Singh, Srinivas D. Nemani, Ellie Yieh | 2021-05-04 |
| 10950429 | Methods of forming amorphous carbon hard mask layers and hard mask layers formed therefrom | Bhargav S. Citla, Srinivas D. Nemani | 2021-03-16 |
| 10916433 | Methods of forming metal silicide layers and metal silicide layers formed therefrom | He Ren, Maximillian Clemons, Minrui Yu, Bencherki Mebarki, Mehul Naik +2 more | 2021-02-09 |
| 10714331 | Method to fabricate thermally stable low K-FinFET spacer | Mihaela Balseanu, Srinivas D. Nemani, Ellie Yieh | 2020-07-14 |
| 10008448 | Dielectric/metal barrier integration to prevent copper diffusion | He Ren, Mehul Naik, Yong Cao | 2018-06-26 |
| 9633861 | Cu/barrier interface enhancement | Weifeng YE, Mihaela Balseanu, Xiaojun Zhang, Xiaolan Ba, Yu Jin +1 more | 2017-04-25 |
| 9601431 | Dielectric/metal barrier integration to prevent copper diffusion | He Ren, Mehul Naik, Yong Cao, Yana Cheng, Sree Rangasai V. Kesapragada | 2017-03-21 |
| 9580801 | Enhancing electrical property and UV compatibility of ultrathin blok barrier film | Xiaolan Ba, Weifeng YE, Yu Jin, Li-Qun Xia, Deenesh Padhi +1 more | 2017-02-28 |
| 9478460 | Cobalt selectivity improvement in selective cobalt process sequence | Weifeng YE, Li-Qun Xia, Kang Sub Yim, Kelvin Chan | 2016-10-25 |
| 9299605 | Methods for forming passivation protection for an interconnection structure | He Ren, Mehul Naik, Yong Cao, Sree Rangasai V. Kesapragada, Yana Cheng | 2016-03-29 |
| 9105695 | Cobalt selectivity improvement in selective cobalt process sequence | Weifeng YE, Li-Qun Xia, Kang Sub Yim, Kelvin Chan | 2015-08-11 |
| 8852962 | Apparatus and methods for silicon oxide CVD resist planarization | Steven Verhaverbeke, Roman Gouk, Li-Qun Xia, Yu Jin | 2014-10-07 |
| 8758638 | Copper oxide removal techniques | Weifeng YE, Victor Nguyen, Mihaela Balseanu, Li-Qun Xia, Derek R. Witty | 2014-06-24 |
| 8753989 | Method to increase tensile stress of silicon nitride films using a post PECVD deposition UV cure | Mihaela Balseanu, Michael S. Cox, Li-Qun Xia, Jia-Sheng Lee, Vladimir Zubkov +4 more | 2014-06-17 |
| 8481422 | Prevention and reduction of solvent and solution penetration into porous dielectrics using a thin barrier layer | Kelvin Chan, Khaled A. Elsheref, Alexandros T. Demos, Lipan Li, Li-Qun Xia +1 more | 2013-07-09 |
| 8445075 | Method to minimize wet etch undercuts and provide pore sealing of extreme low k (k<2.5) dielectrics | Huiwen Xu, Li-Qun Xia, Amir Al-Bayati, Derek R. Witty, Hichem M'Saad | 2013-05-21 |
| 8343881 | Silicon dioxide layer deposited with BDEAS | Yong Won Lee, Vladimir Zubkov, Li-Qun Xia, Prahallad Iyengar, Sanjeev Baluja +4 more | 2013-01-01 |
| 8138104 | Method to increase silicon nitride tensile stress using nitrogen plasma in-situ treatment and ex-situ UV cure | Mihaela Balseanu, Victor Nguyen, Li-Qun Xia, Derek R. Witty, Hichem M'Saad +1 more | 2012-03-20 |
| 8129290 | Method to increase tensile stress of silicon nitride films using a post PECVD deposition UV cure | Mihaela Balseanu, Michael S. Cox, Li-Qun Xia, Jia-Sheng Lee, Vladimir Zubkov +4 more | 2012-03-06 |
| 7923386 | Method to improve the step coverage and pattern loading for dielectric films | Mihaela Balseanu, Li-Qun Xia, Hichem M'Saad | 2011-04-12 |