Issued Patents All Time
Showing 51–75 of 86 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7405247 | Conductive adhesive composition | Krishna G. Sachdev, Daniel G. Berger, Kelly Chioujones, Glenn G. Daves | 2008-07-29 |
| 7393419 | Conductive adhesive rework method | Krishna G. Sachdev, Daniel G. Berger, Kelly Chioujones, Glenn G. Daves | 2008-07-01 |
| 7319591 | Optimized thermally conductive plate and attachment method for enhanced thermal performance and reliability of flip chip organic packages | Jeffrey T. Coffin, Michael A. Gaynes, David L. Questad, Kamal K. Sikka, Jamil A. Wakil | 2008-01-15 |
| 7312261 | Thermal interface adhesive and rework | Krishna G. Sachdev, Daniel G. Berger, Kelly Chioujones, Glenn G. Daves | 2007-12-25 |
| 7288839 | Apparatus and methods for cooling semiconductor integrated circuit package structures | Evan G. Colgan, Jeffrey D. Gelorme, Kamal K. Sikka, Jeffrey A. Zitz | 2007-10-30 |
| 7268428 | Thermal paste containment for semiconductor modules | David L. Edwards, Sushumna Iruvanti, Wei Zou | 2007-09-11 |
| 7079393 | Fluidic cooling systems and methods for electronic components | Evan G. Colgan, Frank L. Pompeo, Glenn G. Daves, Bruce K. Furman, David L. Edwards +7 more | 2006-07-18 |
| 7031162 | Method and structure for cooling a dual chip module with one high power chip | Amilcar R. Arvelo, Kamal K. Sikka | 2006-04-18 |
| 6827505 | Optoelectronic package structure and process for planar passive optical and optoelectronic devices | Subhash L. Shinde, L. Wynn Herron, Mario J. Interrante, How T. Lin, Steven P. Ostrander +2 more | 2004-12-07 |
| 6459160 | Package with low stress hermetic seal | Lewis S. Goldmann, Eric D. Perfecto, Raed A. Sherif, William F. Shutler | 2002-10-01 |
| 6451155 | Method using a thin adhesion promoting layer for bonding silicone elastomeric material to nickel and use thereof in making a heat sink assembly | David L. Edwards, Da-Yuan Shih, Ajay P. Giri | 2002-09-17 |
| 6342407 | Low stress hermetic seal | Lewis S. Goldmann, Eric D. Perfecto, Raed A. Sherif, William F. Shutler | 2002-01-29 |
| 6333460 | Structural support for direct lid attach | Raed A. Sherif, David J. Womac | 2001-12-25 |
| 6294408 | Method for controlling thermal interface gap distance | David L. Edwards, Michael Emmett, Sushumna Iruvanti, Raed A. Sherif, Kamal K. Sikka | 2001-09-25 |
| 6278184 | Solder disc connection | Peter J. Brofman, Patrick A. Coico, Mark G. Courtney, Lewis S. Goldmann, Raymond A. Jackson +3 more | 2001-08-21 |
| 6274214 | Microelectronic package module with temporary lid | Joseph Chan, John B. Pavelka, Frank L. Pompeo | 2001-08-14 |
| 6255139 | Method for providing a thermal path through particles embedded in a thermal cap | David L. Edwards, Patrick A. Coico, Sushumna Iruvanti, Frank L. Pompeo, Raed A. Sherif | 2001-07-03 |
| 6253986 | Solder disc connection | Peter J. Brofman, Patrick A. Coico, Mark G. Courtney, Lewis S. Goldmann, Raymond A. Jackson +3 more | 2001-07-03 |
| 6222263 | Chip assembly with load-bearing lid in thermal contact with the chip | Raed A. Sherif, David J. Womac | 2001-04-24 |
| 6218730 | Apparatus for controlling thermal interface gap distance | Raed A. Sherif | 2001-04-17 |
| 6111314 | Thermal cap with embedded particles | David L. Edwards, Patrick A. Coico, Sushumna Iruvanti, Frank L. Pompeo, Raed A. Sherif | 2000-08-29 |
| 6070321 | Solder disc connection | Peter J. Brofman, Patrick A. Coico, Mark G. Courtney, Lewis S. Goldmann, Raymond A. Jackson +3 more | 2000-06-06 |
| 6054008 | Process for adhesively attaching a temporary lid to a microelectronic package | Joseph Chan, John B. Pavelka, Frank L. Pompeo | 2000-04-25 |
| 6046074 | Hermetic thin film metallized sealband for SCM and MCM-D modules | Dale Curtis McHerron | 2000-04-04 |
| 5982038 | Cast metal seal for semiconductor substrates | Lannie R. Bolde, James H. Covell, David L. Edwards, Lewis S. Goldmann, Peter A. Gruber | 1999-11-09 |