Issued Patents All Time
Showing 26–50 of 86 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9583408 | Reducing directional stress in an orthotropic encapsulation member of an electronic package | Marcus E. Interrante, Yi Pan, Jeffrey A. Zitz | 2017-02-28 |
| 9577361 | Pluggable LGA socket for high density interconnects | Alan F. Benner, Benjamin V. Fasano, Paul F. Fortier | 2017-02-21 |
| 9401315 | Thermal hot spot cooling for semiconductor devices | Paul F. Bodenweber, Taryn J. Davis, Marcus E. Interrante, Chenzhou Lian, Kenneth C. Marston +2 more | 2016-07-26 |
| 9293439 | Electronic module assembly with patterned adhesive array | Edmund Blackshear, Elaine Cyr, Benjamin V. Fasano, Paul F. Fortier, Marcus E. Interrante +4 more | 2016-03-22 |
| 9105500 | Non-hermetic sealed multi-chip module package | Paul F. Bodenweber, Krishna R. Tunga, Jeffrey A. Zitz | 2015-08-11 |
| 9093563 | Electronic module assembly with patterned adhesive array | Edmund Blackshear, Elaine Cyr, Benjamin V. Fasano, Paul F. Fortier, Marcus E. Interrante +4 more | 2015-07-28 |
| 9089051 | Multichip module with stiffening frame and associated covers | Shidong Li, Gregg B. Monjeau, Kamal K. Sikka, Thomas Weiss | 2015-07-21 |
| 9089052 | Multichip module with stiffening frame and associated covers | Shidong Li, Gregg B. Monjeau, Kamal K. Sikka, Thomas Weiss | 2015-07-21 |
| 9087834 | Multichip electronic packages and methods of manufacture | Suresh D. Kadakia, Kamal K. Sikka, Jeffrey A. Zitz | 2015-07-21 |
| 8906809 | Multichip electronic packages and methods of manufacture | Martin Beaumier, Steven P. Ostrander, Kamal K. Sikka, Jeffrey A. Zitz | 2014-12-09 |
| 8900927 | Multichip electronic packages and methods of manufacture | Martin Beaumier, Steven P. Ostrander, Kamal K. Sikka, Jeffrey A. Zitz | 2014-12-02 |
| 8860206 | Multichip electronic packages and methods of manufacture | Kamal K. Sikka, Krishna R. Tunga, Jeffrey A. Zitz | 2014-10-14 |
| 8592970 | Multichip electronic packages and methods of manufacture | Kamal K. Sikka, Krishna R. Tunga, Jeffrey A. Zitz | 2013-11-26 |
| 8587114 | Multichip electronic packages and methods of manufacture | Suresh D. Kadakia, Kamal K. Sikka, Jeffrey A. Zitz | 2013-11-19 |
| 8531025 | Thermal paste containment for semiconductor modules | David L. Edwards, Sushumna Iruvanti, Wei Zou | 2013-09-10 |
| 8445331 | Multichip electronic packages and methods of manufacture | Suresh D. Kadakia, Kamal K. Sikka, Jeffrey A. Zitz | 2013-05-21 |
| 8232636 | Reliability enhancement of metal thermal interface | James N. Humenik, Sushumna Iruvanti, Richard Langlois, Hsichang Liu, Govindarajan Natarajan +4 more | 2012-07-31 |
| 8037594 | Method of forming a flip-chip package | Jeffrey T. Coffin, Michael A. Gaynes, David L. Questad, Kamal K. Sikka, Jamil A. Wakil | 2011-10-18 |
| 8021925 | Thermal paste containment for semiconductor modules | David L. Edwards, Sushumna Iruvanti, Wei Zou | 2011-09-20 |
| 7992627 | Microjet module assembly | Raschid J. Bezama, Govindarajan Natarajan, Kamal K. Sikka | 2011-08-09 |
| 7808781 | Apparatus and methods for high-performance liquid cooling of multiple chips with disparate cooling requirements | Evan G. Colgan, Michael A. Gaynes, John Harold Magerlein, Kenneth C. Marston, Roger R. Schmidt | 2010-10-05 |
| 7768121 | Apparatus and methods for cooling semiconductor integrated circuit package structures | Evan G. Colgan, Jeffrey D. Gelorme, Kamal K. Sikka, Jeffrey A. Zitz | 2010-08-03 |
| 7516776 | Microjet module assembly | Raschid J. Bezama, Govindarajan Natarajan, Kamal K. Sikka | 2009-04-14 |
| 7518235 | Method and structure to provide balanced mechanical loading of devices in compressively loaded environments | Patrick A. Coico, David L. Edwards, Benjamin V. Fasano, Lewis S. Goldmann, Ellyn M. Ingalls +2 more | 2009-04-14 |
| 7489512 | Optimized thermally conductive plate and attachment method for enhanced thermal performance and reliability of flip chip organic packages | Jeffrey T. Coffin, Michael A. Gaynes, David L. Questad, Kamal K. Sikka, Jamil A. Wakil | 2009-02-10 |