Issued Patents All Time
Showing 51–75 of 119 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7978473 | Cooling apparatus with cold plate formed in situ on a surface to be cooled | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Bruce K. Furman, Madhusudan K. Iyengar +3 more | 2011-07-12 |
| 7932169 | Interconnection for flip-chip using lead-free solders and having improved reaction barrier layers | Luc Belanger, Stephen L. Buchwalter, Leena Paivikki Buchwalter, Ajay P. Giri, Jonathan H. Griffith +8 more | 2011-04-26 |
| 7928585 | Sprocket opening alignment process and apparatus for multilayer solder decal | Stephen L. Buchwalter, Peter A. Gruber, Jae-Woong Nah | 2011-04-19 |
| 7923849 | Interconnections for flip-chip using lead-free solders and having reaction barrier layers | Keith E. Fogel, Balaram Ghosal, Sung Kwon Kang, Stephen Kilpatrick, Paul A. Lauro +2 more | 2011-04-12 |
| 7898076 | Structure and methods of processing for solder thermal interface materials for chip cooling | Bruce K. Furman, Madhusudan K. Iyengar, Paul A. Lauro, Yves Martin, Roger R. Schmidt +2 more | 2011-03-01 |
| 7838954 | Semiconductor structure with solder bumps | Stephen L. Buchwalter, Peter A. Gruber, Jae-Woong Nah | 2010-11-23 |
| 7819376 | Techniques for forming interconnects | David Danovitch, Mukta G. Farooq, Peter A. Gruber, John U. Knickerbocker, George R. Proto | 2010-10-26 |
| 7784669 | Method and process for reducing undercooling in a lead-free tin-rich solder alloy | Gareth G. Hougham, Kamalesh K. Srivastava, Sung Kwon Kang, Brian R. Sundlof, S. Jay Chey +4 more | 2010-08-31 |
| 7786001 | Electrical interconnect structure and method | Stephen L. Buchwalter, Bruce K. Furman, Peter A. Gruber, Jae-Woong Nah | 2010-08-31 |
| 7731079 | Cooling apparatus and method of fabrication thereof with a cold plate formed in situ on a surface to be cooled | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Bruce K. Furman, Madhusudan K. Iyengar +3 more | 2010-06-08 |
| 7703661 | Method and process for reducing undercooling in a lead-free tin-rich solder alloy | Gareth G. Hougham, Kamalesh K. Srivastava, Sung Kwon Kang, Brian R. Sundlof, S. Jay Chey +4 more | 2010-04-27 |
| 7694719 | Patterned metal thermal interface | Bruce K. Furman, Sushumna Iruvanti, Paul A. Lauro, Yves Martin, Theodore G. van Kessel +1 more | 2010-04-13 |
| 7538565 | High density integrated circuit apparatus, test probe and methods of use thereof | Brian S. Beaman, Keith E. Fogel, Paul A. Lauro, Maurice Heathcote Norcott, George F. Walker | 2009-05-26 |
| 7523852 | Solder interconnect structure and method using injection molded solder | Stephen L. Buchwalter, Claudius Feger, Peter A. Gruber, Sung Kwon Kang, Paul A. Lauro | 2009-04-28 |
| 7495342 | Angled flying lead wire bonding process | Brian S. Beaman, Keith E. Fogel, Paul A. Lauro | 2009-02-24 |
| 7410833 | Interconnections for flip-chip using lead-free solders and having reaction barrier layers | Keith E. Fogel, Balaram Ghosal, Sung Kwon Kang, Stephen Kilpatrick, Paul A. Lauro +2 more | 2008-08-12 |
| 7399421 | Injection molded microoptics | Lawrence Jacobowitz, Stephen L. Buchwalter, Casimer M. DeCusatis, Peter A. Gruber | 2008-07-15 |
| 7368924 | Probe structure having a plurality of discrete insulated probe tips projecting from a support surface, apparatus for use thereof and methods of fabrication thereof | Brian S. Beaman, Keith E. Fogel, Paul A. Lauro, Yun-Hsin Liao, Daniel Peter Morris | 2008-05-06 |
| 7348270 | Techniques for forming interconnects | David Danovitch, Mukta G. Farooq, Peter A. Gruber, John U. Knickerbocker, George R. Proto | 2008-03-25 |
| 7332922 | Method for fabricating a structure for making contact with a device | Brian S. Beaman, Keith E. Fogel, Paul A. Lauro, Maurice Heathcote Norcott | 2008-02-19 |
| 7282945 | Wafer scale high density probe assembly, apparatus for use thereof and methods of fabrication thereof | Brian S. Beaman, Keith E. Fogel, Paul A. Lauro | 2007-10-16 |
| 7276919 | High density integral test probe | Brian S. Beaman, Keith E. Fogel, Paul A. Lauro, Maurice Heathcote Norcott, George F. Walker | 2007-10-02 |
| 7273803 | Ball limiting metallurgy, interconnection structure including the same, and method of forming an interconnection structure | Yu-Ting Cheng, Stefanie Chiras, Donald W. Henderson, Sung Kwon Kang, Stephen Kilpatrick +2 more | 2007-09-25 |
| 7180179 | Thermal interposer for thermal management of semiconductor devices | Lawrence S. Mok, Evan G. Colgan, Minhua Lu | 2007-02-20 |
| 7079393 | Fluidic cooling systems and methods for electronic components | Evan G. Colgan, Frank L. Pompeo, Glenn G. Daves, Hilton T. Toy, Bruce K. Furman +7 more | 2006-07-18 |