Issued Patents All Time
Showing 101–119 of 119 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5838160 | Integral rigid chip test probe | Brian S. Beaman, Keith E. Fogel, Paul A. Lauro, Maurice Heathcote Norcott, George F. Walker | 1998-11-17 |
| 5821763 | Test probe for high density integrated circuits, methods of fabrication thereof and methods of use thereof | Brian S. Beaman, Keith E. Fogel, Paul A. Lauro, Maurice Heathcote Norcott, George F. Walker | 1998-10-13 |
| 5810607 | Interconnector with contact pads having enhanced durability | Paul A. Lauro, Keith E. Fogel, Brian S. Beaman, Maurice Heathcote Norcott | 1998-09-22 |
| 5804607 | Process for making a foamed elastomeric polymer | Jeffrey Hedrick, James L. Hedrick, Jons Hilborn, Yun-Hsin Liao, Robert D. Miller | 1998-09-08 |
| 5785538 | High density test probe with rigid surface structure | Brian S. Beaman, Keith E. Fogel, Paul A. Lauro, Maurice Heathcote Norcott | 1998-07-28 |
| 5756021 | Electronic devices comprising dielectric foamed polymers | James L. Hedrick | 1998-05-26 |
| 5726211 | Process for making a foamed elastometric polymer | Jeffrey Hedrick, James L. Hedrick, Jons Hilborn, Yun-Hsin Liao, Robert D. Miller | 1998-03-10 |
| 5700844 | Process for making a foamed polymer | Jeffrey Hedrick, James L. Hedrick, Yun-Hsin Liao, Robert D. Miller | 1997-12-23 |
| 5635846 | Test probe having elongated conductor embedded in an elostomeric material which is mounted on a space transformer | Brian S. Beaman, Keith E. Fogel, Paul A. Lauro, Maurice Heathcote Norcott, George F. Walker | 1997-06-03 |
| 5531022 | Method of forming a three dimensional high performance interconnection package | Brain S. Beaman, Fuad E. Doany, Keith E. Fogel, James L. Hedrick, Paul A. Lauro +4 more | 1996-07-02 |
| 5441690 | Process of making pinless connector | Juan Ayala-Esquilin, Brian S. Beaman, Rudolf A. Haring, James L. Hedrick, George F. Walker | 1995-08-15 |
| 5433631 | Flex circuit card elastomeric cable connector assembly | Brian S. Beaman, Fuad E. Doany, Thomas J. Dudek, Alphonso P. Lanzetta, William J. Tkazyik +1 more | 1995-07-18 |
| 5386344 | Flex circuit card elastomeric cable connector assembly | Brian S. Beaman, Fuad E. Doany, Thomas J. Dudek, Alphonso P. Lanzetta, William J. Tkazyik +1 more | 1995-01-31 |
| 5371654 | Three dimensional high performance interconnection package | Brian S. Beaman, Fuad E. Doany, Keith E. Fogel, James L. Hedrick, Paul A. Lauro +4 more | 1994-12-06 |
| 4970570 | Use of tapered head pin design to improve the stress distribution in the braze joint | Birendra Agarwala, Paul H. Palmateer | 1990-11-13 |
| 4880684 | Sealing and stress relief layers and use thereof | David W. Boss, Timothy Carr, Derry J. Dubetsky, George M. Greenstein, Warren D. Grobman +6 more | 1989-11-14 |
| 4835593 | Multilayer thin film metallurgy for pin brazing | Anthony F. Arnold, Joseph A. Corso, Shukla Kapur, Walter F. Lange | 1989-05-30 |
| 4781970 | Strengthening a ceramic by post sinter coating with a compressive surface layer | Steven G. Barbee, Hung-Chang W. Huang, Donald J. Hunt, Jungihl Kim, Jae Man Park +1 more | 1988-11-01 |
| 4751349 | Zirconium as an adhesion material in a multi-layer metallic structure | Jungihl Kim, Walter F. Lange, Sheree H. Wen | 1988-06-14 |