Issued Patents All Time
Showing 76–100 of 119 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7002247 | Thermal interposer for thermal management of semiconductor devices | Lawrence S. Mok, Evan G. Colgan, Minhua Lu | 2006-02-21 |
| 6891360 | Plated probe structure | Brian S. Beaman, Keith E. Fogel, Paul A. Lauro, Eugene J. O'Sullivan, Ho-Ming Tong | 2005-05-10 |
| 6880245 | Method for fabricating a structure for making contact with an IC device | Brian S. Beaman, Keith E. Fogel, Paul A. Lauro, Maurice Heathcote Norcott | 2005-04-19 |
| 6805974 | Lead-free tin-silver-copper alloy solder composition | Won Kook Choi, Charles C. Goldsmith, Timothy A. Gosselin, Donald W. Henderson, Sung Kwon Kang +1 more | 2004-10-19 |
| 6722032 | Method of forming a structure for electronic devices contact locations | Brian S. Beaman, Keith E. Fogel, Paul A. Lauro, Maurice Heathcote Norcott | 2004-04-20 |
| 6708403 | Angled flying lead wire bonding process | Brian S. Beaman, Keith E. Fogel, Paul A. Lauro | 2004-03-23 |
| 6528984 | Integrated compliant probe for wafer level test and burn-in | Brian S. Beaman, Keith E. Fogel, Paul A. Lauro | 2003-03-04 |
| 6526655 | Angled flying lead wire bonding process | Brian S. Beaman, Keith E. Fogel, Paul A. Lauro | 2003-03-04 |
| 6525551 | Probe structures for testing electrical interconnections to integrated circuit electronic devices | Brian S. Beaman, Keith E. Fogel, Paul A. Lauro, Eugene J. O'Sullivan | 2003-02-25 |
| 6523255 | Process and structure to repair damaged probes mounted on a space transformer | Keith E. Fogel, Paul A. Lauro, Brian S. Beaman | 2003-02-25 |
| 6451155 | Method using a thin adhesion promoting layer for bonding silicone elastomeric material to nickel and use thereof in making a heat sink assembly | Hilton T. Toy, David L. Edwards, Ajay P. Giri | 2002-09-17 |
| 6452406 | Probe structure having a plurality of discrete insulated probe tips | Brian S. Beaman, Keith E. Fogel, Paul A. Lauro, Yun-Hsin Liao, Daniel Peter Morris | 2002-09-17 |
| 6334247 | High density integrated circuit apparatus, test probe and methods of use thereof | Brian S. Beaman, Keith E. Fogel, Paul A. Lauro, Maurice Heathcote Norcott, George F. Walker | 2002-01-01 |
| 6332270 | Method of making high density integral test probe | Brian S. Beaman, Keith E. Fogel, Paul A. Lauro, Maurice Heathcote Norcott, George F. Walker | 2001-12-25 |
| 6329827 | High density cantilevered probe for electronic devices | Brian S. Beaman, Keith E. Fogel, Paul A. Lauro, Maurice Heathcote Norcott | 2001-12-11 |
| 6300780 | High density integrated circuit apparatus, test probe and methods of use thereof | Brian S. Beaman, Keith E. Fogel, Paul A. Lauro, Maurice Heathcote Norcott, George F. Walker | 2001-10-09 |
| 6295729 | Angled flying lead wire bonding process | Brian S. Beaman, Keith E. Fogel, Paul A. Lauro | 2001-10-02 |
| 6286208 | Interconnector with contact pads having enhanced durability | Paul A. Lauro, Keith E. Fogel, Brian S. Beaman, Maurice Heathcote Norcott | 2001-09-11 |
| 6206273 | Structures and processes to create a desired probetip contact geometry on a wafer test probe | Brian S. Beaman, Keith E. Fogel, Paul A. Lauro | 2001-03-27 |
| 6104201 | Method and apparatus for passive characterization of semiconductor substrates subjected to high energy (MEV) ion implementation using high-injection surface photovoltage | Brian S. Beaman, Keith E. Fogel, Paul A. Lauro, Maurice Heathcote Norcott, George F. Walker | 2000-08-15 |
| 6078500 | Pluggable chip scale package | Brian S. Beaman, Keith E. Fogel, Paul A. Lauro | 2000-06-20 |
| 6062879 | High density test probe with rigid surface structure | Brian S. Beaman, Keith E. Fogel, Paul A. Lauro, Maurice Heathcote Norcott | 2000-05-16 |
| 6054651 | Foamed elastomers for wafer probing applications and interposer connectors | Keith E. Fogel, James L. Hedrick, Paul A. Lauro, Yun-Hsin Liao | 2000-04-25 |
| 5931222 | Adhesion promoting layer for bonding polymeric adhesive to metal and a heat sink assembly using same | Hilton T. Toy, David L. Edwards, Ajay P. Giri | 1999-08-03 |
| 5914614 | High density cantilevered probe for electronic devices | Brian S. Beaman, Keith E. Fogel, Paul A. Lauro, Maurice Heathcote Norcott | 1999-06-22 |