Issued Patents All Time
Showing 26–50 of 119 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8963340 | No flow underfill or wafer level underfill and solder columns | Claudius Feger, Michael A. Gaynes, Jae-Woong Nah | 2015-02-24 |
| 8945995 | Copper post solder bumps on substrates | Jae-Woong Nah | 2015-02-03 |
| 8927877 | Looped interconnect structure | Hsin-An Shen, Yung Ching Chen, Ming-Chung Sung, Chih-Hang Tung, Chien-Hsun Lee | 2015-01-06 |
| 8877556 | Copper post solder bumps on substrates | Jae-Woong Nah | 2014-11-04 |
| 8803333 | Three-dimensional chip stack and method of forming the same | Chen-Hua Yu, Chih-Hang Tung | 2014-08-12 |
| 8754514 | Multi-chip wafer level package | Chun-Hui Yu, Chih-Hang Tung, Tung-Liang Shao, Chen-Hua Yu | 2014-06-17 |
| 8754666 | Probe structure having a plurality of discrete insulated probe tips projecting from a support surface, apparatus for use thereof and methods of fabrication thereof | Brian S. Beaman, Keith E. Fogel, Paul A. Lauro, Yun-Hsin Liao, Daniel Peter Morris | 2014-06-17 |
| 8703274 | Microcavity structure and process | Russell A. Budd, Bing Dang, William Graham, Peter A. Gruber, Richard W. Levine | 2014-04-22 |
| 8691685 | Prevention and control of intermetallic alloy inclusions that form during reflow of Pb free, Sn rich, solders in contacts in microelectronic packaging in integrated circuit contact structures where electroless Ni(P) metallization is present | Sung Kwon Kang, Yoon Chul SON | 2014-04-08 |
| 8685798 | Methods for forming through vias | Tung-Liang Shao, Chih-Hang Tung, Chen-Hua Yu, Hao-Yi Tsai, Mirng-Ji Lii | 2014-04-01 |
| 8679964 | Prevention and control of intermetallic alloy inclusions | Sung Kwon Kang, Yoon Chul SON | 2014-03-25 |
| 8669137 | Copper post solder bumps on substrate | Jae-Woong Nah | 2014-03-11 |
| 8541299 | Electrical interconnect forming method | Stephen L. Buchwalter, Bruce K. Furman, Peter A. Gruber, Jae-Woong Nah | 2013-09-24 |
| 8491772 | Redox method of forming a coaxial probe structure of elongated electrical conductors projecting from a support structure | Brian S. Beaman, Keith E. Fogel, Paul A. Lauro, Yun-Hsin Liao, Daniel Peter Morris | 2013-07-23 |
| 8486250 | Electrodeposition method of forming a probe structure having a plurality of discrete insulated probe tips projecting from a support surface | Brian S. Beaman, Keith E. Fogel, Paul A. Lauro, Yun-Hsin Liao, Daniel Peter Morris | 2013-07-16 |
| 8476770 | Apparatus and methods for forming through vias | Tung-Liang Shao, Chih-Hang Tung, Chen-Hua Yu, Hao-Yi Tsai, Mirng-Ji Lii | 2013-07-02 |
| 8476773 | Electrical interconnect structure | Stephen L. Buchwalter, Bruce K. Furman, Peter A. Gruber, Jae-Woong Nah | 2013-07-02 |
| 8314500 | Interconnections for flip-chip using lead-free solders and having improved reaction barrier layers | Luc Belanger, Stephen L. Buchwalter, Leena Paivikki Buchwalter, Ajay P. Giri, Jonathan H. Griffith +8 more | 2012-11-20 |
| 8268719 | Sprocket opening alignment process and apparatus for multilayer solder decal | Stephen L. Buchwalter, Peter A. Gruber, Jae-Woong Nah | 2012-09-18 |
| 8242010 | Electrical interconnect forming method | Stephen L. Buchwalter, Bruce K. Furman, Peter A. Gruber, Jae-Woong Nah | 2012-08-14 |
| 8157158 | Modification of solder alloy compositions to suppress interfacial void formation in solder joints | Peter A. Gruber, Donald W. Henderson, Sung Kwon Kang | 2012-04-17 |
| 8156998 | Patterned metal thermal interface | Bruce K. Furman, Sushumna Iruvanti, Paul A. Lauro, Yves Martin, Theodore G. van Kessel +1 more | 2012-04-17 |
| 8039314 | Metal adhesion by induced surface roughness | Danielle DeGraw, Peter J. Lindgren, Ping-Chuan Wang | 2011-10-18 |
| 8026613 | Interconnections for flip-chip using lead-free solders and having reaction barrier layers | Keith E. Fogel, Balaram Ghosal, Sung Kwon Kang, Stephen Kilpatrick, Paul A. Lauro +2 more | 2011-09-27 |
| 8003512 | Structure of UBM and solder bumps and methods of fabrication | Luc Belanger, Marc A. Bergendahl, Ajay P. Giri, Paul A. Lauro, Valerie Oberson | 2011-08-23 |