Issued Patents All Time
Showing 151–175 of 888 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11069611 | Liner-free and partial liner-free contact/via structures | — | 2021-07-20 |
| 11069567 | Modulating metal interconnect surface topography | Conal E. Murray | 2021-07-20 |
| 11063089 | Resistive memory device with meshed electrodes | Takashi Ando, Lawrence A. Clevenger, Michael Rizzolo | 2021-07-13 |
| 11056426 | Metallization interconnect structure formation | Yann Mignot, Hosadurga Shobha, Hsueh-Chung Chen | 2021-07-06 |
| 11056425 | Structural enhancement of Cu nanowires | Daniel C. Edelstein | 2021-07-06 |
| 11037795 | Planarization of dielectric topography and stopping in dielectric | Hari Prasad Amanapu, Cornelius Brown Peethala, Iqbal Rashid Saraf, Raghuveer R. Patlolla | 2021-06-15 |
| 11035029 | Material for forming metal matrix composite and metal matrix composite bulk | Li-Shing Chou, Chi-San Chen, Chih-Jung Weng, Heng-Yi Tsai | 2021-06-15 |
| 11031542 | Contact via with pillar of alternating layers | Daniel C. Edelstein, Michael Rizzolo, Theodorus E. Standaert | 2021-06-08 |
| 11031457 | Low resistance high capacitance density MIM capacitor | Baozhen Li | 2021-06-08 |
| 11031339 | Metal interconnects | Raghuveer R. Patlolla, Cornelius Brown Peethala | 2021-06-08 |
| 11024577 | Embedded anti-fuses for small scale applications | Chanro Park, Kenneth Chun Kuen Cheng, Koichi Motoyama | 2021-06-01 |
| 11024539 | Self-aligned cut process for self-aligned via process window | Ruilong Xie, Jing Guo, Kangguo Cheng | 2021-06-01 |
| 11024344 | Landing pad in interconnect and memory stacks: structure and formation of the same | — | 2021-06-01 |
| 11018090 | Selective CVD alignment-mark topography assist for non-volatile memory | Michael Rizzolo, Lawrence A. Clevenger, Benjamin D. Briggs | 2021-05-25 |
| 11018087 | Metal interconnects | Raghuveer R. Patlolla, Cornelius Brown Peethala | 2021-05-25 |
| 11004736 | Integrated circuit having a single damascene wiring network | Hsueh-Chung Chen, Junli Wang, Somnath Ghosh, Lawrence A. Clevenger | 2021-05-11 |
| 11004735 | Conductive interconnect having a semi-liner and no top surface recess | Cornelius Brown Peethala, Michael Rizzolo, Oscar van der Straten | 2021-05-11 |
| 10998227 | Metal insulator metal capacitor with extended capacitor plates | Theodorus E. Standaert | 2021-05-04 |
| 10991619 | Top via process accounting for misalignment by increasing reliability | Chen Zhang, Lawrence A. Clevenger, Benjamin D. Briggs, Brent A. Anderson | 2021-04-27 |
| 10975464 | Hard mask films with graded vertical concentration formed using reactive sputtering in a radio frequency deposition chamber | Ekmini Anuja De Silva, Yongan Xu, Abraham Arceo de la Pena | 2021-04-13 |
| 10971447 | BEOL electrical fuse | Baozhen Li, Andrew Tae Kim | 2021-04-06 |
| 10971398 | Cobalt interconnect structure including noble metal layer | Theodorus E. Standaert | 2021-04-06 |
| 10964647 | Dielectric crack stop for advanced interconnects | Baozhen Li, Griselda Bonilla | 2021-03-30 |
| 10957657 | Advanced crack stop structure | Baozhen Li, Xiao Hu Liu, Griselda Bonilla | 2021-03-23 |
| 10957643 | Formation of semiconductor devices including electrically programmable fuses | Juntao Li | 2021-03-23 |