Issued Patents All Time
Showing 226–250 of 888 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10756260 | Co-fabrication of magnetic device structures with electrical interconnects having reduced resistance through increased conductor grain size | Lawrence A. Clevenger, Liying Jiang, Sebastian Naczas, Michael Rizzolo | 2020-08-25 |
| 10748812 | Air-gap containing metal interconnects | Kenneth Chun Kuen Cheng, Koichi Motoyama, Kisik Choi | 2020-08-18 |
| 10741751 | Fully aligned semiconductor device with a skip-level via | Nicholas Anthony Lanzillo, Benjamin D. Briggs, Hsueh-Chung Chen, Lawrence A. Clevenger | 2020-08-11 |
| 10741748 | Back end of line metallization structures | Joseph F. Maniscalco, Raghuveer R. Patlolla, Cornelius Brown Peethala | 2020-08-11 |
| 10741609 | Pre-patterned etch stop for interconnect trench formation overlying embedded MRAM structures | Gangadhara Raja Muthinti, Michael Rizzolo, Oscar van der Straten | 2020-08-11 |
| 10741441 | Collar formation for chamfer-less and chamfered vias | Baozhen Li, Andrew Tae Kim | 2020-08-11 |
| 10741397 | Liner planarization-free process flow for fabricating metallic interconnect structures | — | 2020-08-11 |
| 10734579 | Protuberant contacts for resistive switching devices | Takashi Ando, Lawrence A. Clevenger | 2020-08-04 |
| 10734277 | Top via back end of the line interconnect integration | Lawrence A. Clevenger, Benjamin D. Briggs, Brent A. Anderson | 2020-08-04 |
| 10727123 | Interconnect structure with fully self-aligned via pattern formation | Kafai Lai | 2020-07-28 |
| 10727070 | Liner-less contact metallization | Praneet Adusumilli, Alexander Reznicek, Oscar van der Straten | 2020-07-28 |
| 10714596 | Directional deposition of protection layer | Hong He, Juntao Li, Junli Wang | 2020-07-14 |
| 10714382 | Controlling performance and reliability of conductive regions in a metallization network | Raghuveer R. Patlolla, Cornelius Brown Peethala | 2020-07-14 |
| 10714379 | Reducing contact resistance in vias for copper interconnects | Conal E. Murray | 2020-07-14 |
| 10707413 | Formation of embedded magnetic random-access memory devices | Ashim Dutta, John C. Arnold, Michael Rizzolo, Jon Slaughter | 2020-07-07 |
| 10707166 | Advanced metal interconnects | — | 2020-07-07 |
| 10699945 | Back end of line integration for interconnects | Cornelius Brown Peethala, Raghuveer R. Patlolla, Roger A. Quon | 2020-06-30 |
| 10699050 | Front-end-of-line shape merging cell placement and optimization | David Wolpert, Erwin Behnen, Lawrence A. Clevenger, Patrick Watson, Timothy A. Schell | 2020-06-30 |
| 10692925 | Dielectric fill for memory pillar elements | Michael Rizzolo, Theodorus E. Standaert, Isabel Cristina Chu, Son V. Nguyen | 2020-06-23 |
| 10692722 | Single process for linear and metal fill | Praneet Adusumilli, Alexander Reznicek, Oscar van der Straten | 2020-06-23 |
| 10686126 | Back end of line metallization structures | Joseph F. Maniscalco, Raghuveer R. Patlolla, Cornelius Brown Peethala | 2020-06-16 |
| 10686124 | Contact via structures | Daniel C. Edelstein, Bruce B. Doris, Henry K. Utomo, Theodorus E. Standaert, Nathan P. Marchack | 2020-06-16 |
| 10685915 | Via contact resistance control | Theodorus E. Standaert | 2020-06-16 |
| 10685784 | Back-end-of-the line capacitor | — | 2020-06-16 |
| 10679892 | Multi-buried ULK field in BEOL structure | Yann Mignot, Hosadurga Shobha | 2020-06-09 |